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  precision analog microcontroller 12-bit analog i/o, arm7tdmi ? mcu aduc7019/20/21/22/24/25/26/27 features analog i/o multichannel, 12-bit, 1 msps adc up to 16 adc channels 1 fully differential and single-ended modes 0 to v ref analog input range 12-bit voltage output dacs up to 4 dac outputs available 1 on-chip voltage reference on-chip temperature sensor (3c) voltage comparator microcontroller arm7tdmi core, 16-bit/32-bit risc architecture jtag port supports code download and debug clocking options trimmed on-chip oscillator (3%) external watch crystal external clock source up to 44 mhz 41.78 mhz pll with programmable divider memory 62 kb flash/ee memory, 8 kb sram in-circuit download, jtag-based debug software triggered in-circuit reprogrammability on-chip peripherals uart, 2 i 2 c? and spi? serial i/o up to 40-pin gpio port 1 4 general-purpose timers wake-up and watchdog timers (wdt) power supply monitor three-phase, 16-bit pwm generator 1 programmable logic array (pla) external memory interface, up to 512 kb 1 power specified for 3 v operation active mode: 11 ma @ 5 mhz; 40 ma @ 41.78 mhz packages and temperature range from 40-lead 6 mm 6 mm lfcsp to 80-lead lqfp 1 fully specified for C40c to +125c operation tools low-cost quickstart? development system full third-party support applications industrial control and automation systems smart sensors, precision instrumentation base station systems, optical networking functional block diagram 04955-001 1msps 12-bit adc dac0 12-bit dac dac1 12-bit dac dac2 12-bit dac dac3 12-bit dac pwm0 h pwm0 l pwm1 h pwm1 l pwm2 h pwm2 l three- phase pwm ext. memory interface aduc7026 adc0 xclki xclko rst v ref adc11 mux temp sensor bandgap ref osc and pll psm por cmp0 cmp1 cmp out pla 4 general purpose timers 2k 32 sram 31k 16 flash/eeprom serial i/o uart, spi, i 2 c gpio jtag arm7tdmi-based mcu with additional peripherals figure 1. 1 depending on part model. see ordering guide for more information. rev. a information furnished by analog devices is believed to be accurate and reliable. however, no responsibility is assumed by analog devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. specifications subject to change without notice. no license is granted by implication or otherwise under any patent or patent rights of analog devices. trademarks and registered trademarks are the property of their respective owners. one technology way, p.o. box 9106, norwood, ma 02062-9106, u.s.a. tel: 781.329.4700 www.analog.com fax: 781.461.3113 ?2006 analog devices, inc. all rights reserved.
aduc7019/20/21/22/24/25/26/27 rev. a | page 2 of 92 table of contents features .............................................................................................. 1 applications....................................................................................... 1 functional block diagram .............................................................. 1 revision history ............................................................................... 3 general description ......................................................................... 4 detailed block diagram .............................................................. 5 specifications..................................................................................... 6 timing specifications .................................................................. 9 absolute maximum ratings.......................................................... 16 esd caution................................................................................ 16 pin configurations and function descriptions ......................... 17 aduc7019/aduc7020/aduc7021/aduc7022 .................. 17 aduc7024/aduc7025 ............................................................. 20 aduc7026/aduc7027 ............................................................. 23 typical performance characteristics ........................................... 27 terminology .................................................................................... 30 adc specifications .................................................................... 30 dac specifications..................................................................... 30 overview of the arm7tdmi core............................................. 31 thumb mode (t)........................................................................ 31 long multiply (m)...................................................................... 31 embeddedice (i) ....................................................................... 31 exceptions ................................................................................... 31 arm registers ............................................................................ 31 interrupt latency........................................................................ 32 memory organization ................................................................... 33 memory access........................................................................... 33 flash/ee memory....................................................................... 33 sram ........................................................................................... 33 memory mapped registers ....................................................... 33 adc circuit overview .................................................................. 37 transfer function....................................................................... 37 typical operation....................................................................... 38 mmrs interface.......................................................................... 38 converter operation.................................................................. 40 driving the analog inputs ........................................................ 42 calibration................................................................................... 42 temperature sensor ................................................................... 42 band gap reference................................................................... 42 nonvolatile flash/ee memory ..................................................... 43 programming.............................................................................. 43 security ........................................................................................ 44 flash/ee control interface ....................................................... 44 execution time from sram and flash/ee............................ 46 reset and remap ........................................................................ 46 other analog peripherals.............................................................. 48 dac.............................................................................................. 48 power supply monitor ............................................................... 49 comparator ................................................................................. 50 oscillator and pllpower control........................................ 51 digital peripherals.......................................................................... 53 three-phase pwm..................................................................... 53 general-purpose input/output................................................ 60 serial port mux........................................................................... 62 uart serial interface................................................................ 62 serial peripheral interface......................................................... 65 i 2 c compatible interfaces ......................................................... 67 programmable logic array (pla)........................................... 71 processor reference peripherals................................................... 74 interrupt system ......................................................................... 74 timers .......................................................................................... 75 external memory interfacing ................................................... 79
aduc7019/20/21/22/24/25/26/27 rev. a | page 3 of 92 hardware design considerations ................................................. 83 power supplies............................................................................. 83 grounding and board layout recommendations ................. 84 clock oscillator........................................................................... 84 power-on reset operation......................................................... 85 typical system configuration ................................................... 85 development tools ......................................................................... 86 pc-based tools ........................................................................... 86 in-circuit serial downloader ................................................... 86 outline dimensions........................................................................ 87 ordering guide ........................................................................... 89 revision history 1/06rev. 0 to rev. a changes to table 1 ............................................................................6 added the flash/ee memory reliability section .......................43 changes to table 30 ........................................................................52 changes to serial peripheral interface .........................................66 changes to ordering guide...........................................................90 10/05revision 0: initial version
aduc7019/20/21/22/24/25/26/27 rev. a | page 4 of 92 general description the aduc7019/7020/7021/7022/7024/7025/7026/7027 are fully integrated, 1 msps, 12-bit data acquisition systems incorporat- ing high performance multichannel adcs, 16-bit/32-bit mcus and flash/ee memory on a single chip. the adc consists of up to 12 single-ended inputs. an additional four inputs are available but are multiplexed with the four dac output pins. the four dac outputs are only available on certain models (aduc7020, and aduc7026). however, in many cases where the dac outputs are not present, these pins can still be used as additional adc inputs, giving a maximum of 16 adc input channels. the adc can operate in single-ended or differential input modes. the adc input voltage is 0 to v ref . low-drift bandgap reference, temperature sensor, and voltage comparator complete the adc peripheral set. depending on the part model, up to four buffered voltage output dacs are available on-chip. the dac output range is programmable to one of three voltage ranges. the devices operate from an on-chip oscillator and a pll generating an internal high frequency clock of 41.78 mhz. this clock is routed through a programmable clock divider from which the mcu core clock operating frequency is generated. the microcontroller core is an arm7tdmi, 16-bit/32-bit risc machine, which offers up to 41 mips peak performance. eight kilobytes of sram and 62 kilobytes of nonvolatile flash/ee memory are provided on-chip. the arm7tdmi core views all memory and registers as a single linear array. on-chip factory firmware supports in-circuit serial download via the uart or i 2 c serial interface ports, while nonintrusive emulation is also supported via the jtag interface. these features are incorporated into a low-cost quickstart? development system supporting this microconverter? family. the parts operate from 2.7 v to 3.6 v and are specified over an industrial temperature range of ?40c to +125c. when operating at 41.78 mhz, the power dissipation is typically 120 mw. the aduc7019/7020/7021/7022/7024/7025/7026/7027 are available in a variety of memory models and packages.
aduc7019/20/21/22/24/25/26/27 rev. a | page 5 of 92 detailed block diagram 04955-002 77 adc0 78 adc1 79 adc2/cmp0 80 adc3/cmp1 1 adc4 2 adc5 3 adc6 4 adc7 5 adc8 6 adc9 7 adc10 76 adc11 9 adcneg 20 bm/p0.0/cmp out /plai[7]/ms2 68 v ref v ref 18 p4.6/ad14/plao[14] 19 p4.7/ad15/plao[15] *see selection table for feature availability on different models. 55 p4.0/ad8/plao[8] 56 p4.1/ad9/plao[9] 63 p4.2/ad10/plao[10] 64 p4.3/ad11/plao[11] 65 p4.4/ad12/plao[12] 66 p4.5/ad13/plao[13] 62 p1.0/t1/spm0/plai[0] 61 p1.1/spm1/plai[1] 60 p1.2/spm2/plai[2] 59 p1.3/spm3/plai[3] 58 p1.4/spm4/plai[4]/irq2 57 p1.5/spm5/plai[5]/irq3 52 p1.6/spm6/plai[6] 14 tms 15 tdi 23 tdo 22 tck 21 p0.6/t1/mrst/plao[3]/ae 49 p2.1/ws/pwm0 h /plao[6] 50 p2.2/rs/pwm0 l /plao[7] 17 p2.3/ae 33 p2.4/pwm0 h /ms0 35 p2.5/pwm0 l /ms1 36 p2.6/pwm1 h /ms2 48 p2.7/pwm1 l /ms3 24 p0.2/pwm2 l /bhe 16 p0.1/pwm2 h /ble 34 p0.3/trst/a16/adc busy 42 p2.0/spm9/plao[5]/conv start 51 p1.7/spm7/plao[0] mux 12-bit voltage outputdac buf 10 dac0*/adc12 12-bit voltage outputdac buf 11 dac1*/adc13 12-bit voltage outputdac buf 12 dac2*/adc14 12-bit voltage outputdac buf 13 dac3*/adc15 29 p3.0/ad0/pwm0 h /plai[8] 30 p3.1/ad1/pwm0 l /plai[9] 31 p3.2/ad2/pwm1 h /plai[10] 32 p3.3/ad3/pwm1 l /plai[11] 38 p3.4/ad4/pwm2 h /plai[12] 39 p3.5/ad5/pwm2 l /plai[13] 46 p3.6/ad6/pwm trip /plai[14] 47 p3.7/ad7/pwm sync /plai[15] 44 xclko 45 xclki 40 irq0/p0.4/pwm trip /plao[1]/ms1 41 irq1/p0.5/adc busy /plao[2]/ms0 43 p0.7/eclk/xclk/spm8/plao[4] aduc7026* 69 dac ref 70 dacgnd 75 dacv dd 37 rst 27 lv dd 28 dgnd 54 iov dd 25 iognd 26 iov dd 53 iognd 74 av dd 73 av dd 67 refgnd 71 agnd 72 agnd 8 gnd ref three- phase pwm dac control arm7tdmi mcu core 62kbytes flash/ee (31k 16 bits) 8192 bytes user ram (2k 32 bits) wakeup/ rtc timer power supply monitor prog. clock divider jtag emulator downloader prog. logic array spi/i 2 c serial interface serial port multiplexer uart serial port por interrupt controller 12-bit sar adc 1msps adc control pll osc band gap reference cmp out /irq mux dac temp sensor figure 2.
aduc7019/20/21/22/24/25/26/27 rev. a | page 6 of 92 specifications avdd = iov dd = 2.7 v to 3.6 v, v ref = 2.5 v internal reference, f core = 41.78 mhz, t a = 40c to 125c, unless otherwise noted. table 1. parameter min typ max unit test conditions/comments adc channel specifications eight acquisition clocks and fadc/2 adc power-up time 5 s dc accuracy 1, 2 resolution 12 bits integral nonlinearity 0.6 1.0 1.5 lsb lsb 2.5 v internal reference 1.0 v external reference differential nonlinearity 3, 4 0.5 +0.7/?0.6 +1/?0.9 lsb lsb 2.5 v internal reference 1.0 v external reference dc code distribution 1 lsb adc input is a dc voltage endpoint errors 5 offset error 1 2 lsb offset error match 1 lsb gain error 2 5 lsb gain error match 1 lsb dynamic performance f in = 10 khz sine wave, f sample = 1 msps signal-to-noise ratio (snr) 69 db incl udes distortion and noise components total harmonic distortion (thd) ?78 db peak harmonic or spurious noise ?75 db channel-to-channel crosstalk ?80 db measured on adjacent channels analog input input voltage ranges differential mode v cm 6 v ref /2 v single-ended mode 0 to v ref v leakage current 1 6 a input capacitance 20 pf during adc acquisition on-chip voltage reference 0.47 f from v ref to agnd output voltage 2.5 v accuracy 5 mv t a = 25c reference temperature coefficient 40 ppm/c power supply rejection ratio 75 db output impedance 70 t a = 25c internal v ref power-on time 1 ms external reference input 7 input voltage range 0.625 av dd v input impedance 65 k dac channel specifications r l = 5 k , c l = 100 pf dc accuracy 8 resolution 12 bits relative accuracy 2 lsb differential nonlinearity 1 lsb guaranteed monotonic offset error 15 mv 2.5 v internal reference gain error 9 1 % gain error mismatch 0.1 % % of full scale on dac0
aduc7019/20/21/22/24/25/26/27 rev. a | page 7 of 92 parameter min typ max unit test conditions/comments analog outputs output voltage range_0 0 to dac ref v dac ref range: dacgnd to dacv dd output voltage range_1 0 to 2.5 v output voltage range_2 0 to dacv dd v output impedance 2 dac ac characteristics voltage output settling time 10 s digital to analog glitch energy 20 nv-sec 1 lsb change at major carry comparator input offset voltage 15 mv input bias current 1 a input voltage range agnd av dd ? 1.2 v input capacitance 7 pf hysteresis 4, 6 2 15 mv hysteresis can be turned on or off via the cmphyst bit in the cmpcon register response time 3 s 100 mv overdrive and configured with cmpres = 11 temperature sensor voltage output at 25c 780 mv voltage tc ?1.3 mv/c accuracy 3 c power supply monitor (psm) iov dd trip point selection 2.79 v two selectable trip points 3.07 v power supply trip point accuracy 2.5 % of the selected nominal trip point voltage power-on reset 2.36 v glitch immunity on reset pin 3 50 s watchdog timer ( wdt ) timeout period 0 512 sec flash/ee memory endurance 10 10,000 cycles data retention 11 20 years t j = 85c digital inputs all digital inputs excluding xclki and xclko logic 1 input current 0.2 1 a v ih = vdd or v ih = 5 v logic 0 input current ?40 ?60 a v il = 0 v; except tdi on aduc7019/20/21/22/24/25 ?80 ?120 a v il = 0 v; tdi, on aduc7019/20/21/22/24/25 input capacitance 10 pf logic inputs 3 all logic inputs excluding xclki and xclko v inl , input low voltage 0.8 v v inh , input high voltage 2.0 v logic outputs all digital outputs excluding xclki and xclko v oh , output high voltage 2.4 v i source = 1.6 ma v ol , output low voltage 12 0.4 v i sink = 1.6 ma crystal inputs xclki and xclko logic inputs, xclki only v inl , input low voltage 1.1 v v inh , input high voltage 1.7 v xclki input capacitance 20 pf xclko output capacitance 20 pf
aduc7019/20/21/22/24/25/26/27 rev. a | page 8 of 92 parameter min typ max unit test conditions/comments internal oscillator 32.768 khz 3 % mcu clock rate from 32 khz internal oscillator 326 khz cd = 7 from 32 khz external crystal 41.78 mhz cd = 0 using an external clock 0.05 44 mhz t a = 85c 0.05 41.78 mhz t a = 125c start-up time core clock = 41.78 mhz at power-on 130 ms from pause/nap mode 24 ns cd = 0 3.06 s cd = 7 from sleep mode 1.58 ms from stop mode 1.7 ms programmable logic array (pla) pin propagation delay 12 ns from input pin to output pin element propagation delay 2.5 ns power requirements 13, 14 power supply voltage range av dd ? agnd and iov dd ? iognd 2.7 3.6 v analog power supply currents av dd current 200 a adc in idle mode; all parts except aduc7019 400 a adc in idle mode; aduc7019 only dacv dd current 15 3 25 a digital power supply current iov dd current in normal mode code executing from flash/ee 7 10 ma cd = 7 11 15 ma cd = 3 40 45 ma cd = 0 (41.78 mhz clock) iov dd current in pause mode 25 30 ma cd = 0 (41.78 mhz clock) iov dd current in sleep mode 250 400 a t a = 85c 600 1000 a t a = 125c additional power supply currents adc 2 ma @ 1 msps 0.7 ma @ 62.5 ksps dac 700 a per dac 1 all adc channel specifications are guaranteed d uring normal microconvert er core operation. 2 apply to all adc input channels. 3 measured using the factory set default values in adcof and adcgn. 4 not production tested but supported by design and/or characterization data on production release. 5 measured using the factory set default valu es in adcof and adcgn using an external ad845 op amp as an input buffer stage as sh own in figure 47. based on external adc system components, the user may need to execute a system calibration to remove external endpoint errors and achiev e these specifications (see the calibration section). 6 the input signal can be centered on any dc common-mode voltage (v cm ) as long as this value is within the adc voltage input range specified. 7 when using an external reference input pin, the internal refere nce must be disabled by setting the lsb in the refcon memory ma pped register to 0. 8 dac linearity is calcul ated using a reduced co de range of 100 to 3995. 9 dac gain error is calculated using a reduced code range of 100 to internal 2.5 v v ref . 10 endurance is qualified as per jedec standard 22 method a117 and measured at ?40c, +25c, +85c, and +125c. 11 retention lifetime equivalent at junction temperature (t j ) = 85c as per jedec standard 22 method a117. retention lifetime derates with junction temperature. 12 test carried out with a maximum of eight i/o set to a low output level. 13 power supply current consumption is measured in normal, pause, and sleep modes under the follow ing conditions: normal mode: 3. 6 v supply, pause mode: 3.6 v supply, sleep mode: 3.6 v supply. 14 iov dd power supply current decreases typically by 2 ma during a flash/ee erase cycle. 15 on the aduc7019/20/21/22, this current must be added to av dd current.
aduc7019/20/21/22/24/25/26/27 rev. a | page 9 of 92 timing specifications table 2. external memory write cycle parameter min typ max unit clk uclk t ms_after_clkh 0 4 ns t addr_after_clkh 4 8 ns t ae_h_after_ms ? clk t ae (xmxpar[14:12] + 1) x clk t hold_addr_after_ae_l ? clk + (!xmxpar[10]) x clk t hold_addr_before_wr_l (!xmxpar[8]) x clk t wr_l_after_ae_l ? clk + (!xmxpar[10] + !xmxpar[8]) x clk t data_after_wr_l 8 12 ns t wr (xmxpar[7:4] + 1) x clk t wr_h_after_clkh 0 4 ns t hold_data_after_wr_h (!xmxpar[8]) x clk t ben_after_ae_l ? clk t release_ms_after_wr_h (!xmxpar[8] + 1) x clk 04955-052 clk clk t ms_after_clkh t ae_h_after_ms t ae t wr_l_after_ae_l ms ae wr rd a/d[15:0] ffff 9abc 5678 9abe 1234 ben0 ben1 a16 t wr t wr_h_after_clkh t hold_data_after_wr_h t hold_addr_after_ae_l t hold_addr_before_wr_l t data_after_wr_l t ben_after_ae_l t addr_after_clkh t release_ms_after_wr_h figure 3. external memory write cycle
aduc7019/20/21/22/24/25/26/27 rev. a | page 10 of 92 table 3. external memory read cycle parameter min typ max unit clk uclk t ms_after_clkh 4 8 ns t addr_after_ clkh 4 16 ns t ae_h_after_ms ? clk t ae (xmxpar[14:12] + 1) x clk t hold_addr_after_ae_l ? clk + (!xmxpar[10]) x clk t rd_l_after_ae_l ? clk + (!xmxpar[10] + !xmxpar[9]) x clk t data_after_rd_l 8 12 ns t rd (xmxpar[3:0] + 1) x clk t rd_h_after_clkh 0 4 ns t hold_data_after_rd_h (!xmxpar[9]) x clk t release_ms_after_rd_h clk 04955-053 eclk gp0 ae wr rd clk t ms_after_clkh t ae t rd_l_after_ae_l t rd t rd_h_after_clkh t hold_data_after_rd_h t data_after_rd_l t hold_addr_after_ae_l t addr_after_clkh t ae_h_after_ms t release_ms_after_rd_h a /d[15:0] ffff 234b cdef d14a 234a 89ab ben0 ben1 a16 figure 4. external memory read cycle
aduc7019/20/21/22/24/25/26/27 rev. a | page 11 of 92 table 4. i 2 c timing in fast mode (400 khz) slave parameter description min max master typ unit t l sclock low pulse width 1 200 1360 ns t h sclock high pulse width 1 100 1140 ns t shd start condition hold time 300 251350 ns t dsu data setup time 100 740 ns t dhd data hold time 50 400 ns t rsu setup time for repeated start 100 12.51350 ns t psu stop condition setup time 100 400 ns t buf bus-free time between a stop condit ion and a start condition 1.3 s t r rise time for both clock and sdata 100 300 200 ns t f fall time for both clock and sdata 60 100 20 ns t sup pulse width of spike suppressed 50 ns 1 t hclk depends on the clock divider or cd bits in pllcon mmr. t hclk = t uclk /2 cd . 0 4955-054 s data (i/o) t buf msb lsb ack msb 1 9 8 2?7 1 sclk (i) ps stop condition start condition s(r) repeated start t sup t r t f t f t r t h t l t sup t dsu t dhd t rsu t dhd t dsu t shd t psu figure 5. i 2 c compatible in terface timing
aduc7019/20/21/22/24/25/26/27 rev. a | page 12 of 92 table 5. spi master mode timing (phase mode = 1) parameter description min typ max unit t sl sclock low pulse width 1 (spidiv + 1) t hclk ns t sh sclock high pulse width 1 (spidiv + 1) t hclk ns t dav data output valid after sclock edge 25 ns t dsu data input setup time before sclock edge 2 1 t uclk ns t dhd data input hold time after sclock edge 2 2 t uclk ns t df data output fall time 5 12.5 ns t dr data output rise time 5 12.5 ns t sr sclock rise time 5 12.5 ns t sf sclock fall time 5 12.5 ns 1 t hclk depends on the clock divider or cd bits in pllcon mmr. t hclk = t uclk /2 cd . 2 t uclk = 23.9 ns. it corresponds to the 41.78 mhz internal clock from the pll before the clock divider. 0 4955-055 sclock (polarity = 0) sclock (polarity = 1) mosi msb bits 6?1 lsb miso msb in bits 6?1 lsb in t sh t sl t sr t sf t dr t df t dav t dsu t dhd figure 6. spi master mode timing (phase mode = 1)
aduc7019/20/21/22/24/25/26/27 rev. a | page 13 of 92 table 6. spi master mode timing (phase mode = 0) parameter description min typ max unit t sl sclock low pulse width 1 (spidiv + 1) t hclk ns t sh sclock high pulse width 1 (spidiv + 1) t hclk ns t dav data output valid after sclock edge 25 ns t dosu data output setup before sclock edge 75 ns t dsu data input setup time before sclock edge 2 1 t uclk ns t dhd data input hold time after sclock edge 2 2 t uclk ns t df data output fall time 5 12.5 ns t dr data output rise time 5 12.5 ns t sr sclock rise time 5 12.5 ns t sf sclock fall time 5 12.5 ns 1 t hclk depends on the clock divider or cd bits in pllcon mmr. t hclk = t uclk /2 cd . 2 t uclk = 23.9 ns. it corresponds to the 41.78 mhz internal clock from the pll before the clock divider. 04955-056 sclock (polarity = 0) sclock (polarity = 1) t sh t sl t sr t sf mosi msb bits 6?1 lsb miso msb in bits 6?1 lsb in t dr t df t dav t dosu t dsu t dhd figure 7. spi master mode timing (phase mode = 0)
aduc7019/20/21/22/24/25/26/27 rev. a | page 14 of 92 table 7. spi slave mode timing (phase mode = 1) parameter description min typ max unit t cs cs to sclock edge 1 2 t hclk + 2 t uclk ns t sl sclock low pulse width 2 (spidiv + 1) t hclk ns t sh sclock high pulse width 2 (spidiv + 1) t hclk ns t dav data output valid after sclock edge 25 ns t dsu data input setup time before sclock edge 1 1 t uclk ns t dhd data input hold time after sclock edge 1 2 t uclk ns t df data output fall time 5 12.5 ns t dr data output rise time 5 12.5 ns t sr sclock rise time 5 12.5 ns t sf sclock fall time 5 12.5 ns t sfs cs high after sclock edge 0 ns 1 t uclk = 23.9 ns. it corresponds to the 41.78 mhz internal clock from the pll before the clock divider. 2 t hclk depends on the clock divider or cd bits in pllcon mmr. t hclk = t uclk /2 cd . 04955-057 sclock (polarity = 0) cs sclock (polarity = 1) t sh t sl t sr t sf t sfs miso msb bits 6?1 lsb mosi msb in bits 6?1 lsb in t cs t dhd t dsu t dav t dr t df figure 8. spi slave mode timing (phase mode = 1)
aduc7019/20/21/22/24/25/26/27 rev. a | page 15 of 92 table 8. spi slave mode timing (phase mode = 0) parameter description min typ max unit t cs cs to sclock edge 1 2 t hclk + 2 t uclk ns t sl sclock low pulse width 2 (spidiv + 1) t hclk ns t sh sclock high pulse width 2 (spidiv + 1) t hclk ns t dav data output valid after sclock edge 25 ns t dsu data input setup time before sclock edge 1 1 t uclk ns t dhd data input hold time after sclock edge 1 2 t uclk ns t df data output fall time 5 12.5 ns t dr data output rise time 5 12.5 ns t sr sclock rise time 5 12.5 ns t sf sclock fall time 5 12.5 ns t docs data output valid after cs edge 25 ns t sfs cs high after sclock edge 0 ns 1 t uclk = 23.9 ns. it corresponds to the 41.78 mhz internal clock from the pll before the clock divider. 2 t hclk depends on the clock divider or cd bits in pllcon mmr. t hclk = t uclk /2 cd . 04955-058 sclock (polarity = 0) cs sclock (polarity = 1) t sh t sl t sr t sf t sfs miso mosi t cs msb in bits 6?1 lsb in t dhd t dsu msb bits 6?1 lsb t docs t dav t dr t df figure 9. spi slave mode timing (phase mode = 0)
aduc7019/20/21/22/24/25/26/27 rev. a | page 16 of 92 absolute maximum ratings agnd = refgnd = dacgnd = gnd ref ; t a = 25c, unless otherwise noted. table 9. stresses above those listed under absolute maximum ratings may cause permanent damage to the device. this is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. only one absolute maximum rating can be applied at any one time. esd caution esd (electrostatic discharge) sensitive device. electros tatic charges as high as 4000 v readily accumulate on the human body and test equipment and can discharge wi thout detection. although this product features proprietary esd protection circuitry, permanent dama ge may occur on devices subjected to high energy electrostatic discharges. therefore, proper esd precautions are recommended to avoid performance degradation or loss of functionality. parameter rating av dd to iov dd ?0.3 v to +0.3 v agnd to dgnd ?0.3 v to +0.3 v iov dd to iognd, av dd to agnd ?0.3 v to +6 v digital input voltage to iognd ?0.3 v to +5.3 v digital output voltage to iognd ?0.3 v to iov dd + 0.3 v v ref to agnd ?0.3 v to av dd + 0.3 v analog inputs to agnd ?0.3 v to av dd + 0.3 v analog outputs to agnd ?0.3 v to av dd + 0.3 v operating temperature range industrial C40c to +125c storage temperature range C65c to +150c junction temperature 150c ja thermal impedance (40-pin csp) 26c/w ja thermal impedance (64-pin csp) 24c/w ja thermal impedance (64-pin lqfp) 47c/w ja thermal impedance (80-pin lqfp) 38c/w peak solder reflow temperature snpb assemblies (10 sec to 30 sec) 240c pb-free assemblies (20 sec to 40 sec) 260c
aduc7019/20/21/22/24/25/26/27 rev. a | page 17 of 92 pin configurations and function descriptions aduc7019/aduc7020/aduc7021/aduc7022 0 4955-064 aduc7019/ aduc7020 top view (not to scale) pin 1 indicator 1 2 3 4 5 6 7 8 9 10 adc3/cmp1 adc4 gnd ref dac0/adc12 dac1/adc13 dac2/adc14 dac3/adc15 tms tdi bm/p0.0/cmp out /plai[7] p1.3/spm3/plai[3] p1.4/spm4/plai[4]/irq2 p1.5/spm5/plai[5]/irq3 p1.6/spm6/plai[6] p1.7/spm7/plao[0] xclki xclko p0.7/eclk/xclk/spm8/plao[4] p2.0/spm9/plao[5]/conv start irq1/p0.5/adc busy /plao[2] 30 29 28 27 26 25 24 23 22 21 11 12 13 14 15 16 17 18 19 20 p0.6/t1/mrst/plao[3] tck tdo iognd iov dd lv dd dgnd p0.3/trst/adc busy rst irq0/p0.4/pwm trip /plao[1] adc2/cmp0 adc1 adc0 av dd agnd v ref p4.2/plao[10] p1.0/t1/spm0/plai[0] p1.1/spm1/plai[1] p1.2/spm2/plai[2] 40 39 38 37 36 35 34 33 32 31 figure 10. aduc7019/aduc7020 40-lead lfcsp_vq pin configuration 0 4955-065 aduc7021 top view (not to scale) pin 1 indicator 1 2 3 4 5 6 7 8 9 10 adc4 adc5 adc6 adc7 gnd ref dac0/adc12 dac1/adc13 tms tdi bm/p0.0/cmp out /plai[7] p1.3/spm3/plai[3] p1.4/spm4/plai[4]/irq2 p1.5/spm5/plai[5]/irq3 p1.6/spm6/plai[6] p1.7/spm7/plao[0] xclki xclko p0.7/eclk/xclk/spm8/plao[4] p2.0/spm9/plao[5]/conv start irq1/p0.5/adc busy /plao[2] 30 29 28 27 26 25 24 23 22 21 11 12 13 14 15 16 17 18 19 20 p0.6/t1/mrst/plao[3] tck tdo iognd iov dd lv dd dgnd p0.3/trst/adc busy rst irq0/p0.4/pwm trip /plao[1] adc3/cmp1 adc2/cmp0 adc1 adc0 av dd agnd v ref p1.0/t1/spm0/plai[0] p1.1/spm1/plai[1] p1.2/spm2/plai[2] 40 39 38 37 36 35 34 33 32 31 figure 11. aduc702140-lead lfcsp_vq pin configuration 04955-066 aduc7022 top view (not to scale) pin 1 indicator 1 2 3 4 5 6 7 8 9 10 adc5 adc6 adc7 adc8 adc9 gnd ref tms tdi bm/p0.0/cmp out /plai[7] p0.6/t1/mrst/plao[3] p1.2/spm2/plai[2] p1.3/spm3/plai[3] p1.4/spm4/plai[4]/irq2 p1.5/spm5/plai[5]/irq3 p1.6/spm6/plai[6] p1.7/spm7/plao[0] xclki xclko p0.7/eclk/xclk/spm8/plao[4] p2.0/spm9/plao[5]/conv start 30 29 28 27 26 25 24 23 22 21 11 12 13 14 15 16 17 18 19 20 tck tdo iognd iov dd lv dd dgnd p0.3/trst/adc busy rst irq0/p0.4/pwm trip /plao[1] irq1/p0.5/adc busy /plao[2] adc4 adc3/cmp1 adc2/cmp0 adc1 adc0 av dd agnd v ref p1.0/t1/spm0/plai[0] p1.1/spm1/plai[1] 40 39 38 37 36 35 34 33 32 31 figure 12. aduc7022 40-lead lfcsp_vq pin configuration
aduc7019/20/21/22/24/25/26/27 rev. a | page 18 of 92 table 10. pin function descriptions (aduc7019/aduc7020/aduc7021/aduc7022) pin no. 7019/7020 7021 7022 mnemonic description 38 37 36 adc0 single-ended or differential analog input 0. 39 38 37 adc1 single-ended or differential analog input 1. 40 39 38 adc2/cmp0 single-ended or differential analog input 2/comparator positive input. 1 40 39 adc3/cmp1 single-ended or differential analog input 3 (buffered input on aduc7019)/comparator negative input. 2 1 40 adc4 single-ended or differential analog input 4. ? 2 1 adc5 single-ended or differential analog input 5. ? 3 2 adc6 single-ended or differential analog input 6. ? 4 3 adc7 single-ended or differential analog input 7. ? ? 4 adc8 single-ended or differential analog input 8. ? ? 5 adc9 single-ended or differential analog input 9. 3 5 6 gnd ref ground voltage reference for the adc. for optimal performance, the analog power supply should be separated from iognd and dgnd. 4 6 ? dac0/adc12 dac0 voltage output/single-ended or differential analog input 12. 5 7 ? dac1/adc13 dac1 voltage output/single-ended or differential analog input 13. 6 ? ? dac2/adc14 dac2 voltage output/single-ended or differential analog input 14. 7 ? ? dac3/adc15 dac3 voltage output on aduc7020. on the aduc7019, a 10 nf capacitor needs to be connected between this pin and agnd/single-ended or differential analog input 15. 8 8 7 tms test mode select, jtag test port input. debug and download access. 9 9 8 tdi test data in, jtag test port input. debug and download access. 10 10 9 bm/p0.0/cmp out /plai[7] multifunction i/o pin. boot mode (bm). the aduc7019/20/21/22 enter serial download mode if bm is low at reset and execute code if bm is pulled high at reset through a 1 k ? resistor. general-purpose input and output port 0.0/voltage comparator output/programmable logic array input element 7. 11 11 10 p0.6/t1/mrst/plao[3] multifunction pin, driven low after reset. general-purpose output port 0.6/timer1 input/power-on reset output/programmable logic array output element 3. 12 12 11 tck test clock, jtag test port input. debug and download access. 13 13 12 tdo test data out, jtag test port output. debug and download access. 14 14 13 iognd ground for gpio. typically connected to dgnd. 15 15 14 iov dd 3.3 v supply for gpio and input of the on-chip voltage regulator. 16 16 15 lv dd 2.6 v output of the on-chip voltage regulator. this output must be connected to a 0.47 f capacitor to dgnd only. 17 17 16 dgnd ground for core logic. 18 18 17 p0.3/trst/adc busy general-purpose input and output port 0.3/test reset, jtag test port input/ adc busy signal output. 19 19 18 rst reset input, active low. 20 20 19 irq0/p0.4/pwm trip /plao[1] multifunction i/o pin. external interr upt request 0, active high/general- purpose input and output port 0.4/pwm trip external input/programmable logic array output element 1. 21 21 20 irq1/p0.5/adc busy /plao[2] multifunction i/o pin. external interr upt request 1, active high/general- purpose input andoutput port 0.5/adc busy signa l output/programmable logic array output element 2. 22 22 21 p2.0/spm9/plao[5]/conv start serial port multiplexed. general-purpose input and output port 2.0/uart/ programmable logic array output elemen t 5/start conversion input signal for adc. 23 23 22 p0.7/eclk/xclk/spm8/plao[4] serial port multiplexed. genera l-purpose input and output port 0.7/output for external clock signal/i nput to the internal clock generator circuits/uart/ programmable logic array output element 4. 24 24 23 xclko output from the crystal oscillator inverter.
aduc7019/20/21/22/24/25/26/27 rev. a | page 19 of 92 pin no. 7019/7020 7021 7022 mnemonic description 25 25 24 xclki input to the crystal oscillator inverter and input to the internal clock generator circuits. 26 26 25 p1.7/spm7/plao[0] serial port multiplexed. general-pu rpose input and output port 1.7/uart, spi/programmable logic array output element 0. 27 27 26 p1.6/spm6/plai[6] serial port multiplexed. general-pu rpose input and output port 1.6/uart, spi/programmable logic array input element 6. 28 28 27 p1.5/spm5/plai[5]/irq3 serial port multiplexed. general-pu rpose input and output port 1.5/uart, spi/programmable logic array inp ut element 5/external interrupt request 3, active high. 29 29 28 p1.4/spm4/plai[4]/irq2 serial port multiplexed. general-pu rpose input and output port 1.4/uart, spi/programmable logic array inp ut element 4/external interrupt request 2, active high. 30 30 29 p1.3/spm3/plai[3] serial port multiplexed. general-pu rpose input and output port 1.3/uart, i 2 c1/programmable logic array input element 3. 31 31 30 p1.2/spm2/plai[2] serial port multiplexed. general-pu rpose input and output port 1.2/uart, i 2 c1/programmable logic array input element 2. 32 32 31 p1.1/spm1/plai[1] serial port multiplexed. general-pu rpose input and output port 1.1/uart, i 2 c0/programmable logic array input element 1. 33 33 32 p1.0/t1/spm0/plai[0] serial port multiplexed. general- purpose input and output port 1.0/ timer1 input/uart, i 2 c0/programmable logic array input element 0. 34 ? ? p4.2/plao[10] general-purpose input and output port 4.2/programmable logic array output element 10. 35 34 33 v ref 2.5 v internal voltage reference. must be connected to a 0.47 f capacitor when using the internal reference. 36 35 34 agnd analog ground. ground reference point for the analog circuitry. 37 36 35 av dd 3.3 v analog power.
aduc7019/20/21/22/24/25/26/27 rev. a | page 20 of 92 aduc7024/aduc7025 04955-067 1 adc4 2 adc5 3 adc6 4 adc7 5 adc8 6 adc9 7 gnd ref 8 adcneg 9 dac0/adc12 10 dac1/adc13 11 tms 12 tdi 13 p4.6/plao[14] 14 p4.7/plao[15] 15 bm/p0.0/cmp out /plai[7] 16 p0.6/t1/mrst/plao[3] 48 p1.2/spm2/plai[2] 47 p1.3/spm3/plai[3] 46 p1.4/spm4/plai[4]/irq2 45 p1.5/spm5/plai[5]/irq3 44 p4.1/plao[9] 43 p4.0/plao[8] 42 iov dd 41 iognd 40 p1.6/spm6/plai[6] 39 p1.7/spm7/plao[0] 38 p3.7/pwm sync /plai[15] 37 p3.6/pwm trip /plai[14] 36 xclki 35 xclko 34 p0.7/eclk/xclk/spm8/plao[4] 33 p2.0/spm9/plao[5]/conv start 64 adc3/cmp1 63 adc2/cmp0 62 adc1 61 adc0 60 dacv dd 59 av dd 58 agnd 57 dacgnd 56 dac ref 55 v ref 54 p4.5/plao[13] 53 p4.4/plao[12] 52 p4.3/plao[11] 51 p4.2/plao[10] 50 p1.0/t1/spm0/plai[0] 49 p1.1/spm1/plai[1] top view (not to scale) aduc7024/ aduc7025 pin 1 indicator 17 tck 18 tdo 19 iognd 20 iov dd 21 lv dd 22 dgnd 23 p3.0/pwm0 h /plai[8] 24 p3.1/pwm0 l /plai[9] 25 p3.2/pwm1 h /plai[10] 26 p3.3/pwm1 l /plai[11] 27 p0.3/trst/adc busy 28 rst 29 p3.4/pwm2 h /plai[12] 30 p3.5/pwm2 l /plai[13] 31 irq0/p0.4/pwm trip /plao[1] 32 irq1/p0.5/adc busy /plao[2] figure 13. aduc7024/aduc7025 64-lead lfcsp_vq pin configuration 04955-068 1 adc4 2 adc5 3 adc6 4 adc7 5 adc8 6 adc9 7 gnd ref 8 adcneg 9 dac0/adc12 10 dac1/adc13 11 tms 12 tdi 13 p4.6/plao[14] 14 p4.7/plao[15] 15 bm/p0.0/cmp out /plai[7] 16 p0.6/t1/mrst/plao[3] 48 p1.2/spm2/plai[2] 47 p1.3/spm3/plai[3] 46 p1.4/spm4/plai[4]/irq2 45 p1.5/spm5/plai[5]/irq3 44 p4.1/plao[9] 43 p4.0/plao[8] 42 iov dd 41 iognd 40 p1.6/spm6/plai[6] 39 p1.7/spm7/plao[0] 38 p3.7/pwm sync /plai[15] 37 p3.6/pwm trip /plai[14] 36 xclki 35 xclko 34 p0.7/eclk/xclk/spm8/plao[4] 33 p2.0/spm9/plao[5]/conv start 17 tck 18 tdo 19 iognd 20 iov dd 21 lv dd 22 dgnd 23 p3.0/pwm0 h /plai[8] 24 p3.1/pwm0 l /plai[9] 25 p3.2/pwm1 h /plai[10] 26 p3.3/pwm1 l /plai[11] 27 p0.3/trst/adc busy 28 rst 29 p3.4/pwm2 h /plai[12] 30 p3.5/pwm2 l /plai[13] 31 irq0/p0.4/pwm trip /plao[1] 32 irq1/p0.5/adc busy /plao[2] 64 adc3/cmp1 63 adc2/cmp0 62 adc1 61 adc0 60 dacv dd 59 av dd 58 agnd 57 dacgnd 56 dac ref 55 v ref 54 p4.5/plao[13] 53 p4.4/plao[12] 52 p4.3/plao[11] 51 p4.2/plao[10] 50 p1.0/t1/spm0/plai[0] 49 p1.1/spm1/plai[1] top view (not to scale) aduc7024/ aduc7025 pin 1 indicator figure 14. aduc7024/aduc7025 64-lead lqfp pin configuration
aduc7019/20/21/22/24/25/26/27 rev. a | page 21 of 92 table 11. pin function descriptions (aduc7024/aduc 7025 64-lead csp and aduc7024/aduc7025 64-lead lqfp) pin no. mnemonic description 1 adc4 single-ended or differential analog input 4. 2 adc5 single-ended or differential analog input 5. 3 adc6 single-ended or differential analog input 6. 4 adc7 single-ended or differential analog input 7. 5 adc8 single-ended or differential analog input 8. 6 adc9 single-ended or differential analog input 9. 7 gnd ref ground voltage reference for the adc. for opt imal performance, the analog power supply should be separated from iognd and dgnd. 8 adcneg bias point or negative analog input of the adc in pseudo differential mode. must be connected to the ground of the signal to convert. this bias point must be between 0 v and 1 v. 9 dac0/adc12 dac0 voltage output/single-ended or differential analog input 12. dac outputs are not present on the aduc7025. 10 dac1/adc13 dac1 voltage output/single-ended or differential analog input 13. dac outputs are not present on the aduc7025. 11 tms jtag test port input, test mode select. debug and download access. 12 tdi jtag test port input, test data in. debug and download access 13 p4.6/plao[14] general-purpose input and output port 4.6/programmable logic array output element 14. 14 p4.7/plao[15] general-purpose input and output port 4.7/programmable logic array output element 15. 15 bm/p0.0/cmp out /plai[7] multifunction i/o pin. boot mode. the aduc7024/aduc7025 enter download mode if bm is low at reset and executes code if bm is pulled high at reset through a 1 k ? resistor/general-purpose input and output port 0.0/voltage comparator output /programmable logic array input element 7. 16 p0.6/t1/mrst/plao[3] multifunction pin, driven low after reset. general-purpose output port 0.6/timer1 input/power-on reset output/progra mmable logic array output element 3. 17 tck jtag test port input, test clock. debug and download access. 18 tdo jtag test port output, test data out. debug and download access. 19 iognd ground for gpio. typically connected to dgnd. 20 iov dd 3.3 v supply for gpio and input of the on-chip voltage regulator. 21 lv dd 2.6 v output of the on-chip voltage regulator. this output must be connected to a 0.47 f capacitor to dgnd only. 22 dgnd ground for core logic. 23 p3.0/pwm0 h /plai[8] general-purpose input and output port 3.0/ pwm phase 0 high-side output/programmable logic array input element 8. 24 p3.1/pwm0 l /plai[9] general-purpose input and output port 3.1/ pwm phase 0 low-side output/programmable logic array input element 9. 25 p3.2/pwm1 h /plai[10] general-purpose input and output port 3.2/ pwm phase 1 high-side output/programmable logic array input element 10. 26 p3.3/pwm1 l /plai[11] general-purpose input and output port 3.3/ pwm phase 1 low-side output/programmable logic array input element 11. 27 p0.3/trst/adc busy general-purpose input and output port 0.3/jtag test port input, test reset/adc busy signal output. 28 rst reset input, active low. 29 p3.4/pwm2 h /plai[12] general-purpose input and output port 3.4/ pwm phase 2 high-side output/programmable logic array input 12. 30 p3.5/pwm2 l /plai[13] general-purpose input and output port 3.5/ pwm phase 2 low-side output/programmable logic array input element 13. 31 irq0/p0.4/pwm trip /plao[1] multifunction i/o pin. external interrupt requ est 0, active high/general-purpose input and output port 0.4/pwm trip external input/pr ogrammable logic array output element 1. 32 irq1/p0.5/adc busy /plao[2] multifunction i/o pin. external interrupt requ est 1, active high/general-purpose input and output port 0.5/adc busy signal output/programmable logic array output element 2. 33 p2.0/spm9/plao[5]/conv start serial port multiplexed. general-purpose in put and output port 2.0/uart/programmable logic array output element 5/start conversion input signal for adc. 34 p0.7/eclk/xclk/spm8/plao[4] serial port multiplexed. general-purpose inp ut and output port 0.7/output for external clock signal/input to the internal clock generator circuits/uart/programmable logic array output element 4. 35 xclko output from the crystal oscillator inverter.
aduc7019/20/21/22/24/25/26/27 rev. a | page 22 of 92 pin no. mnemonic description 36 xclki input to the crystal oscillator inverter an d input to the internal clock generator circuits. 37 p3.6/pwm trip /plai[14] general-purpose input and output port 3.6/pw m safety cut off/programmable logic array input element 14. 38 p3.7/pwm sync /plai[15] general-purpose input and output port 3.7/pw m synchronization input output/programmable logic array input element 15. 39 p1.7/spm7/plao[0] serial port multiplexed. general-purpose input and output port 1.7/uart, spi/programmable logic array output element 0. 40 p1.6/spm6/plai[6] serial port multiplexed. general-purpose in put and output port 1.6/uart, spi/programmable logic array input element 6. 41 iognd ground for gpio. typically connected to dgnd. 42 iov dd 3.3 v supply for gpio and input of the on-chip voltage regulator. 43 p4.0/plao[8] general-purpose input and output port 4.0/programmable logic array output element 8. 44 p4.1/plao[9] general-purpose input and output port 4.1/programmable logic array output element 9. 45 p1.5/spm5/plai[5]/irq3 serial port multiplexed. general-purpose input and output port 1.5/uart, spi/programmable logic array input element 5/external interrupt request 3, active high. 46 p1.4/spm4/plai[4]/irq2 serial port multiplexed. general-purpose input and output port 1.4/uart, spi/programmable logic array input element 4/external interrupt request 2, active high. 47 p1.3/spm3/plai[3] serial port multiplexed. general-purpose input and output port 1.3/uart, i2c1/programmable logic array input element 3. 48 p1.2/spm2/plai[2] serial port multiplexed. general-purpose input and output port 1.2/uart, i2c1/programmable logic array input element 2. 49 p1.1/spm1/plai[1] serial port multiplexed. general-purpose inpu t and output port 1.1/uart, i2c0/programmable logic array input element 1. 50 p1.0/t1/spm0/plai[0] serial port multiplexed. general-purpose in put and output port 1.0/timer1 input/uart, i 2 c0/programmable logic array input element 0. 51 p4.2/plao[10] general-purpose input and output port 4.2/programmable logic array output element 10. 52 p4.3/plao[11] general-purpose input and output port 4.3/programmable logic array output element 11. 53 p4.4/plao[12] general-purpose input and output port 4.4/programmable logic array output element 12. 54 p4.5/plao[13] general-purpose input and output port 4.5/programmable logic array output element 13. 55 v ref 2.5 v internal voltage reference. must be connected to a 0.47 f capacitor when using the internal reference. 56 dac ref external voltage reference for the dacs. range: dacgnd to dacv dd . 57 dacgnd ground for the dac. typically connected to agnd. 58 agnd analog ground. ground reference point for the analog circuitry. 59 av dd 3.3 v analog power. 60 dacv dd 3.3 v power supply for the dacs. typically connected to av dd . 61 adc0 single-ended or differential analog input 0. 62 adc1 single-ended or differential analog input 1. 63 adc2/cmp0 single-ended or differential an alog input 2/comparator positive input. 64 adc3/cmp1 single-ended or differential an alog input 3/comparator negative input.
aduc7019/20/21/22/24/25/26/27 rev. a | page 23 of 92 aduc7026/aduc7027 04955-069 1 adc4 2 adc5 3 adc6 4 adc7 5 adc8 6 adc9 7 adc10 8 gnd ref 9 adcneg 10 dac0/adc12 11 dac1/adc13 12 dac2/adc14 13 dac3/adc15 14 tms 15 tdi 16 p0.1/pwm2 h /ble 17 p2.3/ae 18 p4.6/ad14/plao[14] 19 p4.7/ad15/plao[15] 20 bm/p0.0/cmp out /plai[7]/ms2 60 p1.2/spm2/plai[2] 59 p1.3/spm3/plai[3] 58 p1.4/spm4/plai[4]/irq2 57 p1.5/spm5/plai[5]/irq3 56 p4.1/ad9/plao[9] 55 p4.0/ad8/plao[8] 54 iov dd 53 iognd 52 p1.6/spm6/plai[6] 51 p1.7/spm7/plao[0] 50 p2.2/rs/pwm0 l /plao[7] 49 p2.1/ws/pwm0 h /plao[6] 48 p2.7/pwm1 l /ms3 47 p3.7/ad7/pwm sync /plai[15] 46 p3.6/ad6/pwm trip /plai[14] 45 xclki 44 xclko 43 p0.7/eclk/xclk/spm8/plao[4] 42 p2.0/spm9/plao[5]/conv start 41 irq1/p0.5/adc busy /plao[2]/ms0 21 p0.6/t1/mrst/plao[3]/ae 22 tck 23 tdo 24 p0.2/pwm2 l /bhe 25 iognd 26 iov dd 27 lv dd 28 dgnd 29 p3.0/ad0/pwm0 h /plai[8] 30 p3.1/ad1/pwm0 l /plai[9] 31 p3.2/ad2/pwm1 h /plai[10] 32 p3.3/ad3/pwm1 l /plai[11] 33 p2.4/pwm0 h /ms0 34 p0.3/trst/a16/adc busy 35 p2.5/pwm0 l /ms1 36 p2.6/pwm1 h /ms2 37 rst 38 p3.4/ad4/pwm2 h /plai[12] 39 p3.5/ad5/pwm2 l /plai[13] 40 irq0/p0.4/pwm trip /plao[1]/ms1 80 adc3/cmp1 79 adc2/cmp0 78 adc1 77 adc0 76 adc11 75 dacv dd 74 av dd 73 av dd 72 agnd 71 agnd 70 dacgnd 69 dac ref 68 v ref 67 refgnd 66 p4.5/ad13/plao[13] 65 p4.4/ad12/plao[12] 64 p4.3/ad11/plao[11] 63 p4.2/ad10/plao[10] 62 p1.0/t1/spm0/plai[0] 61 p1.1/spm1/plai[1] top view (not to scale) aduc7026/ aduc7027 pin 1 indicator figure 15. aduc7026/aduc7027 80-lead lqfp pin configuration table 12. pin function desc riptions (aduc7026/aduc7027) pin no. mnemonic description 1 adc4 single-ended or differential analog input 4. 2 adc5 single-ended or differential analog input 5. 3 adc6 single-ended or differential analog input 6. 4 adc7 single-ended or differential analog input 7. 5 adc8 single-ended or differential analog input 8. 6 adc9 single-ended or differential analog input 9. 7 adc10 single-ended or differential analog input 10. 8 gnd ref ground voltage reference for the adc. for opt imal performance, the analog power supply should be separated from iognd and dgnd. 9 adcneg bias point or negative analog input of the adc in pseudo differential mode. must be connected to the ground of the signal to convert. this bias point must be between 0 v and 1 v. 10 dac0/adc12 dac0 voltage output/single-ended or differential analog input 12. dac outputs are not present on the aduc7027. 11 dac1/adc13 dac1 voltage output/single-ended or differential analog input 13. dac outputs are not present on the aduc7027. 12 dac2/adc14 dac2 voltage output/single-ended or differential analog input 14. dac outputs are not present on the aduc7027. 13 dac3/adc15 dac3 voltage output/single-ended or differential analog input 15. dac outputs are not present on the aduc7027.
aduc7019/20/21/22/24/25/26/27 rev. a | page 24 of 92 pin no. mnemonic description 14 tms jtag test port input, test mode select. debug and download access. 15 tdi jtag test port input, test data in. debug and download access. 16 p0.1/pwm2 h /ble general-purpose input and output port 0.1/ pwm phase 2 high-side output/external memory byte low enable. 17 p2.3/ae general-purpose input and output po rt 2.3/external memory access enable. 18 p4.6/ad14/plao[14] general-purpose input and output port 4.6/external memory interface/programmable logic array output element 14. 19 p4.7/ad15/plao[15] general-purpose input and output port 4.7/external memory interface/programmable logic array output element 15. 20 bm/p0.0/cmp out /plai[7]/ms2 multifunction i/o pin. boot mode. the aduc 7026/aduc7027 enter uart download mode if bm is low at reset and execute code if bm is pulled high at reset through a 1 k resistor/ general-purpose input and output port 0.0/voltage comparator output/programmable logic array input element 7/external memory select 2. 21 p0.6/t1/mrst/plao[3]/ae multifunction pin, driven low after reset. general-purpose output port 0.6/timer1 input/power-on reset output/progra mmable logic array output element 3. 22 tck jtag test port input, test clock. debug and download access. 23 tdo jtag test port output, test data out. debug and download access. 24 p0.2/ pwm2 l /bhe general-purpose input and output port 0.2/ pwm phase 2 low-side output/external memory byte high enable. 25 iognd ground for gpio. typically connected to dgnd. 26 iov dd 3.3 v supply for gpio and input of the on-chip voltage regulator. 27 lv dd 2.6 v output of the on-chip voltage regulator. this output must be connected to a 0.47 f capacitor to dgnd only. 28 dgnd ground for core logic. 29 p3.0/ad0/pwm0 h /plai[8] general-purpose input and output port 3.0/external memory interface/pwm phase 0 high- side output/programmable logic array input element 8. 30 p3.1/ad1/pwm0 l /plai[9] general-purpose input and output port 3.1/external memory interface/pwm phase 0 low- side output/programmable logic array input element 9. 31 p3.2/ad2/pwm1 h /plai[10] general-purpose input and output port 3.2/external memory interface/pwm phase 1 high- side output/programmable logic array input element 10. 32 p3.3/ad3/pwm1 l /plai[11] general-purpose input and output port 3.3/external memory interface/pwm phase 1 low- side output/programmable logic array input element 11. 33 p2.4/pwm0 h /ms0 general-purpose input and output port 2.4/pw m phase 0 high-side output/external memory select 0. 34 p0.3/trst/a16/adc busy general-purpose input and output port 0.3/jtag test port input, test reset/adc busy signal output. 35 p2.5/pwm0 l /ms1 general-purpose input and output port 2.5/pw m phase 0 low-side output/external memory select 1. 36 p2.6/pwm1 h /ms2 general-purpose input and output port 2.6/pw m phase 1 high-side output/external memory select 2. 37 rst reset input, active low. 38 p3.4/ad4/pwm2 h /plai[12] general-purpose input and output port 3.4/external memory interface/pwm phase 2 high- side output/programmable logic array input 12. 39 p3.5/ad5/pwm2 l /plai[13] general-purpose input and output port 3.5/external memory interface/pwm phase 2 low- side output/programmable logic array input element 13. 40 irq0/p0.4/pwm trip /plao[1]/ms1 multifunction i/o pin. external interrupt requ est 0, active high/general-purpose input and output port 0.4/pwm trip external input/ programmable logic array output element 1/external memory select 1. 41 irq1/p0.5/adc busy /plao[2]/ms0 multifunction i/o pin. external interrupt requ est 1, active high/general-purpose input and output port 0.5/adc busy signal output/programmable logic array output element 2/external memory select 0. 42 p2.0/spm9/plao[5]/conv start serial port multiplexed. general-purpose input and output port 2.0/uart/programmable logic array output element 5/start conversion input signal for adc.
aduc7019/20/21/22/24/25/26/27 rev. a | page 25 of 92 pin no. mnemonic description 43 p0.7/eclk/xclk/spm8/ plao[4] serial port multiplexed. general-purpose inp ut and output port 0.7/output for external clock signal/input to the internal clock generator circuits/uart/programmable logic array output element 4. 44 xclko output from the crystal oscillator inverter. 45 xclki input to the crystal oscillator inverter an d input to the internal clock generator circuits. 46 p3.6/ad6/pwm trip /plai[14] general-purpose input and output port 3.6/ex ternal memory interface/pwm safety cut off/programmable logic array input element 14. 47 p3.7/ad7/pwm sync /plai[15] general-purpose input and output port 3.7/external memory interface/pwm synchronization/programmable logic array input element 15. 48 p2.7/pwm1 l /ms3 general-purpose input and output port 2.7/pw m phase 1 low-side output/external memory select 3. 49 p2.1/ws /pwm0 h /plao[6] general-purpose input and output port 2.1/external memory write strobe/pwm phase 0 high-side output/programmable logic array output element 6. 50 p2.2/rs /pwm0 l /plao[7] general-purpose input and output port 2. 2/external memory read strobe/pwm phase 0 low- side output/programmable logic array output element 7. 51 p1.7/spm7/plao[0] serial port multiplexed. general-purpose input and output port 1.7/uart, spi/programmable logic array output element 0. 52 p1.6/spm6/plai[6] serial port multiplexed. general-purpose input and output port 1.6/uart, spi/programmable logic array input element 6. 53 iognd ground for gpio. typically connected to dgnd. 54 iov dd 3.3 v supply for gpio and input of the on-chip voltage regulator. 55 p4.0/ad8/plao[8] general-purpose input and output port 4.0/external memory interface/programmable logic array output element 8. 56 p4.1/ad9/plao[9] general-purpose input and output port 4.1/external memory interface/programmable logic array output element 9. 57 p1.5/spm5/plai[5]/irq3 serial port multiplexed. general-purpose input and output port 1.5/uart, spi/programmable logic array input element 5/external interrupt request 3, active high. 58 p1.4/spm4/plai[4]/irq2 serial port multiplexed. general-purpose input and output port 1.4/uart, spi/programmable logic array input element 4/external interrupt request 2, active high. 59 p1.3/spm3/plai[3] serial port multiplexed. general-purpose inpu t and output port 1.3/uart, i2c1/programmable logic array input element 3. 60 p1.2/spm2/plai[2] serial port multiplexed. general-purpose inpu t and output port 1.2/uart, i2c1/programmable logic array input element 2. 61 p1.1/spm1/plai[1] serial port multiplexed. general-purpose inpu t and output port 1.1/uart, i2c0/programmable logic array input element 1. 62 p1.0/t1/spm0/plai[0] serial port multiplexed. general-purpose input and output port 1.0/timer1 input/uart, i 2 c0/programmable logic array input element 0. 63 p4.2/ad10/plao[10] general-purpose input and output port 4.2/external memory interface/programmable logic array output element 10. 64 p4.3/ad11/plao[11] general-purpose input and output port 4.3/external memory interface/programmable logic array output element 11. 65 p4.4/ad12/plao[12] general-purpose input and output port 4.4/external memory interface/programmable logic array output element 12. 66 p4.5/ad13/plao[13] general-purpose input and output port 4.5/external memory interface/programmable logic array output element 13. 67 refgnd ground for the reference. typically connected to agnd. 68 v ref 2.5 v internal voltage reference. must be connected to a 0.47 f capacitor when using the internal reference. 69 dac ref external voltage reference for the dacs. range: dacgnd to dacv dd . 70 dacgnd ground for the dac. typically connected to agnd. 71, 72 agnd analog ground. ground reference point for the analog circuitry. 73, 74 av dd 3.3 v analog power.
aduc7019/20/21/22/24/25/26/27 rev. a | page 26 of 92 pin no. mnemonic description 75 dacv dd 3.3 v power supply for the dacs. typically connected to av dd . 76 adc11 single-ended or differential analog input 11. 77 adc0 single-ended or differential analog input 0. 78 adc1 single-ended or differential analog input 1. 79 adc2/cmp0 single-ended or differential an alog input 2/comparator positive input. 80 adc3/cmp1 single-ended or differential an alog input 3/comparator negative input.
aduc7019/20/21/22/24/25/26/27 rev. a | page 27 of 92 typical performance characteristics adc codes (lsb) 1.0 ?1.0 ?0.8 ?0.6 ?0.4 ?0.2 0 0.2 0.4 0.6 0.8 0 2000 1000 3000 4000 04955-075 f s = 774ksps figure 16. typical inl error, f s = 774 ksps adc codes (lsb) 1.0 ?1.0 ?0.8 ?0.6 ?0.4 ?0.2 0 0.2 0.4 0.6 0.8 0 2000 1000 3000 4000 04955-077 f s = 1msps figure 17. typical inl error, f s = 1 msps external reference (v) (lsb) (lsb) 1.0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 ?0.1 ?0.2 ?0.3 ?0.5 ?0.6 ?0.7 ?0.8 ?0.9 ?1.0 1.0 1.5 2.0 2.5 3.0 04955-072 wcn wcp figure 18. typical worst case inl error vs. v ref , f s = 774 ksps adc codes (lsb) 1.0 ?1.0 ?0.8 ?0.6 ?0.4 ?0.2 0 0.2 0.4 0.6 0.8 0 2000 1000 3000 4000 04955-074 f s = 774ksps figure 19. typical dnl error, f s = 774 ksps adc codes (lsb) 1.0 ?1.0 ?0.8 ?0.6 ?0.4 ?0.2 0 0.2 0.4 0.6 0.8 0 2000 1000 3000 4000 04955-076 f s = 1msps figure 20. typical dnl error, f s = 1 msps external reference (v) (lsb) (lsb) 0 ?1.0 ?0.9 ?0.8 ?0.7 ?0.6 ?0.5 ?0.4 ?0.3 ?0.2 ?0.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 1.0 1.5 2.0 2.5 3.0 04955-071 wcn wcp figure 21. typical worst case dnl error vs. v ref , f s = 774 ksps
aduc7019/20/21/22/24/25/26/27 rev. a | page 28 of 92 bin frequency 9000 0 1000 2000 3000 4000 5000 6000 7000 8000 1161 1162 1163 04955-073 figure 22. code histogram plot, fs = 774 ksps, v in = 0.7 v frequency (khz) (db) 0 ?160 ?140 ?120 ?100 ?80 ?60 ?40 ?20 0 100 200 04955-078 f s = 774ksps, snr = 69.3db, thd = ?80.8db, phsn = ?83.4db figure 23. dynamic performance, f s = 774 ksps frequency (khz) (db) 20 0 ?160 ?140 ?120 ?100 ?80 ?60 ?40 ?20 0 150 100 50 200 04955-079 f s = 1msps, snr = 70.4db, thd = ?77.2db, phsn = ?78.9db figure 24. dynamic performance, f s = 1 msps external reference (v) snr (db) thd (db) 75 40 45 50 55 60 65 70 ? 76 ?88 ?86 ?84 ?82 ?80 ?78 1.0 1.5 2.0 2.5 3.0 04955-070 snr thd figure 25. typical dynamic performance vs. v ref 04955-060 temperature ( c) code ?50 0 50 100 1000 1500 1450 1400 1350 1300 1250 1200 1150 1100 1050 150 figure 26. on-chip temperature sensor voltage output vs. temperature temperature (c) (ma) 39.8 39.7 38.9 39.0 39.1 39.2 39.3 39.4 39.5 39.6 ?40 25 85 0 125 04955-080 figure 27. current consumptio n vs. temperature @ cd = 0
aduc7019/20/21/22/24/25/26/27 rev. a | page 29 of 92 temperature (c) (ma) 12.05 11.95 12.00 11.55 11.60 11.65 11.70 11.75 11.80 11.85 11.90 ?40 25 85 0 125 04955-081 figure 28. current consumptio n vs. temperature @ cd = 3 temperature (c) (ma) 7.85 7.75 7.80 7.40 7.45 7.50 7.55 7.60 7.65 7.70 ?40 25 85 0 125 04955-082 figure 29. current consumptio n vs. temperature @ cd = 7 temperature (c) (ma) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 ?40 25 85 0 125 04955-083 figure 30. current consumption vs. temperature in sleep mode sampling frequency (ksps) (ma) 37.4 37.2 37.0 36.8 36.6 36.4 36.2 62.25 250.00 500.00 125.00 1000.00 04955-084 figure 31. current consumption vs. adc speed
aduc7019/20/21/22/24/25/26/27 rev. a | page 30 of 92 terminology adc specifications integral nonlinearity the maximum deviation of any code from a straight line passing through the endpoints of the adc transfer function. the endpoints of the transfer function are zero scale, a point ? lsb below the first code transition and full scale, a point ? lsb above the last code transition. differential nonlinearity the difference between the measured and the ideal 1 lsb change between any two adjacent codes in the adc. offset error the deviation of the first code transition (0000 . . . 000) to (0000 . . . 001) from the ideal, that is, +? lsb. gain error the deviation of the last code transition from the ideal ain voltage (full scale ? 1.5 lsb) after the offset error has been adjusted out. signal to (noise + distortion) ratio the measured ratio of signal to (noise + distortion) at the output of the adc. the signal is the rms amplitude of the fundamental. noise is the rms sum of all nonfundamental signals up to half the sampling frequency (f s /2), excluding dc. the ratio is dependent upon the number of quantization levels in the digitization process; the more levels, the smaller the quantization noise. the theoretical signal to (noise + distortion) ratio for an ideal n-bit converter with a sine wave input is given by signal to ( noise + distortion ) = (6.02 n + 1.76) db thus, for a 12-bit converter, this is 74 db. total harmonic distortion the ratio of the rms sum of the harmonics to the fundamental. dac specifications relative accuracy otherwise known as endpoint linearity, relative accuracy is a measure of the maximum deviation from a straight line passing through the endpoints of the dac transfer function. it is measured after adjusting for zero error and full-scale error. voltage output settling time the amount of time it takes for the output to settle to within a 1 lsb level for a full-scale input change.
aduc7019/20/21/22/24/25/26/27 rev. a | page 31 of 92 overview of the arm7tdmi core the arm7? core is a 32-bit reduced instruction set computer (risc). it uses a single 32-bit bus for instruction and data. the length of the data can be 8 bits, 16 bits, or 32 bits. the length of the instruction word is 32 bits. the arm7tdmi is an arm7 core with four additional features: ? t support for the thumb (16 bit) instruction set ? d support for debug ? m support for long multiplications ? i includes the embeddedice module to support embedded system debugging thumb mode (t) an arm instruction is 32 bits long. the arm7tdmi processor supports a second instruction set that has been compressed into 16 bits, called the thumb instruction set. faster execution from 16-bit memory and greater code density can usually be achieved by using the thumb instruction set instead of the arm instruction set, which makes the arm7tdmi core particularly suitable for embedded applications. however, the thumb mode has two limitations: ? thumb code usually uses more instructions for the same job. as a result, arm code is usually best for maximizing the performance of the time-critical code. ? the thumb instruction set does not include some of the instructions needed for exception handling, which automatically switches the core to arm code for exception handling. see the arm7tdmi user guide for details on the core architecture, the programming model, and both the arm and arm thumb instruction sets. long multiply (m) the arm7tdmi instruction set includes four extra instruc- tions that perform 32-bit by 32-bit multiplication with 64-bit result, and 32-bit by 32-bit multiplication-accumulation (mac) with 64-bit result. these results are achieved in fewer cycles than required on a standard arm7 core. embeddedice (i) embeddedice provides integrated on-chip support for the core. the embeddedice module contains the breakpoint and watchpoint registers that allow code to be halted for debugging purposes. these registers are controlled through the jtag test port. when a breakpoint or watchpoint is encountered, the processor halts and enters debug state. once in a debug state, the processor registers can be inspected as well as the flash/ee, the sram, and the memory mapped registers. exceptions arm supports five types of exceptions and a privileged processing mode for each type. the five types of exceptions are: ? normal interrupt or irq. this is provided to service general-purpose interrupt handling of internal and external events. ? fast interrupt or fiq. this is provided to service data transfer or communication channel with low latency. fiq has priority over irq. ? memory abort. ? attempted execution of an undefined instruction. ? software interrupt instruction (swi). this can be used to make a call to an operating system. typically, the programmer defines interrupt as irq, but for higher priority interrupt, that is, faster response time, the programmer can define interrupt as fiq. arm registers arm7tdmi has a total of 37 registers: 31 general-purpose registers and six status registers. each operating mode has dedicated banked registers. when writing user-level programs, 15 general-purpose 32-bit registers (r0 to r14), the program counter (r15) and the current program status register (cpsr) are usable. the remaining registers are only used for system-level programming and for exception handling. when an exception occurs, some of the standard registers are replaced with registers specific to the exception mode. all exception modes have replacement banked registers for the stack pointer (r13) and the link register (r14) as represented in figure 32. the fast interrupt mode has more registers (r8 to r12) for fast interrupt processing. this means the interrupt processing can begin without the need to save or restore these registers, and thus save critical time in the interrupt handling process.
aduc7019/20/21/22/24/25/26/27 rev. a | page 32 of 92 04955-007 usable in user mode system modes only spsr_und spsr_irq spsr_abt spsr_svc r8_fiq r9_fiq r10_fiq r11_fiq r12_fiq r13_fiq r14_fiq r13_und r14_und r0 r1 r2 r3 r4 r5 r6 r7 r8 r9 r10 r11 r12 r13 r14 r15 (pc) r13_irq r14_irq r13_abt r14_abt r13_svc r14_svc spsr_fiq cpsr user mode fiq mode svc mode abort mode irq mode undefined mode figure 32. regist er organization more information relative to the programmers model and the arm7tdmi core architecture can be found in the following documents from arm: ? ddi0029g, arm7tdmi technical reference manual ? ddi0100e, arm architecture reference manual interrupt latency the worst case latency for a fast interrupt request (fiq) consists of the following: ? the longest time the request can take to pass through the synchronizer ? the time for the longest instruction to complete (the longest instruction is an ldm) that loads all the registers including the pc ? the time for the data abort entry ? the time for fiq entry at the end of this time, the arm7tdmi executes the instruc- tion at 0x1c (fiq interrupt vector address). the maximum total time is 50 processor cycles, which is just under 1.2 s in a system using a continuous 41.78 mhz processor clock. the maximum interrupt request (irq) latency calculation is similar, but must allow for the fact that fiq has higher priority and could delay entry into the irq handling routine for an arbitrary length of time. this time can be reduced to 42 cycles if the ldm command is not used. some compilers have an option to compile without using this command. another option is to run the part in thumb mode, where the time is reduced to 22 cycles. the minimum latency for fiq or irq interrupts is a total of five cycles, which consist of the shortest time the request can take through the synchronizer, plus the time to enter the exception mode. note that the arm7tdmi always runs in arm (32-bit) mode when in privileged modes, for example, when executing interrupt service routines.
aduc7019/20/21/22/24/25/26/27 rev. a | page 33 of 92 memory organization the aduc7019/7020/7021/7022/7024/7025/7026/7027 incorporate two separate blocks of memory: 8 kb of sram and 64 kb of on-chip flash/ee memory. sixty-two kilobytes of on- chip flash/ee memory is available to the user, and the remaining 2 kb are reserved for the factory configured boot page. these two blocks are mapped as shown in figure 33. 04955-008 mmrs 0xffffffff 0xffff0000 reserved external memory region 3 0x40000 ffff 0x40000000 reserved external memory region 2 0x30000 ffff 0x30000000 reserved external memory region 1 0x20000 ffff 0x20000000 reserved external memory region 0 0x10000 ffff 0x10000000 reserved flash/ee 0x0008ffff 0x00080000 reserved sram 0x00011fff 0x00010000 remappable memory space (flash/ee or sram) 0x0000ffff 0x00000000 figure 33. physical memory map note that by default, after a reset, the flash/ee memory is mirrored at address 000000000. it is possible to remap the sram at address 000000000 by clearing bit 0 of the remap mmr. this remap function is described in more detail in the flash/ee memory section. memory access the arm7 core sees memory as a linear array of 2 32 byte location where the different blocks of memory are mapped as outlined in figure 33. the aduc7019/7020/7021/7022/7024/7025/7026/7027 memory organizations are configured in little endian format, which means that the least significant byte is located in the lowest byte address, and the most significant byte is in the highest byte address. 0 4955-009 bit 31 byte 2 a 6 2 . . . byte 3 b 7 3 . . . byte 1 9 5 1 . . . byte 0 8 4 0 . . . bit 0 32 bits 0xffffffff 0x00000004 0x00000000 figure 34. little endian format flash/ee memory the total 64 kb of flash/ee memory is organized as 32 k 16 bits (31 k 16 bits is user space and 1 k 16 bits is reserved for the on-chip kernel). the page size of this flash/ee memory is 512 bytes. sixty-two kilobytes of flash/ee memory are available to the user as code and nonvolatile data memory. there is no distinction between data and program as arm code shares the same space. the real width of the flash/ee memory is 16 bits, which means that in arm mode (32-bit instruction), two accesses to the flash/ee are necessary for each instruction fetch. it is therefore recommended to use thumb mode when executing from flash/ee memory for optimum access speed. the maximum access speed for the flash/ee memory is 41.78 mhz in thumb mode and 20.89 mhz in full arm mode. more details about flash/ee access time are outlined later in the execution time from sram and flash/ee section of this data sheet. sram eight kilobytes of sram are available to the user, organized as 2 k 32 bits, that is, two words. arm code can run directly from sram at 41.78 mhz, given that the sram array is configured as a 32-bit wide memory array. more details about sram access time are outlined later in the execution time from sram and flash/ee section of this datasheet. memory mapped registers the memory mapped register (mmr) space is mapped into the upper two pages of the memory array, and accessed by indirect addressing through the arm7 banked registers. the mmr space provides an in terface between the cpu and all on-chip peripherals. all regist ers, except the core registers, reside in the mmr area. all shaded locations shown in figure 35 are unoccupied or reserved locations, and should not be accessed by user software. table 13 shows the full mmr memory map. the access time for reading from or writing to an mmr depends on the advanced microcontroller bus architecture (amba) bus used to access the peripheral. the processor has two amba busses: advanced high performance bus (ahb) used for system modules, and advanced peripheral bus (apb) used for lower performance peripheral. access to the ahb is one cycle, and access to the apb is two cycles. all peripherals on the aduc7019/7020/ 7021/7022/7024/7025/7026/7027 are on the apb except the flash/ee memory, the gpios, and the pwm.
aduc7019/20/21/22/24/25/26/27 rev. a | page 34 of 92 pwm flash control interface gpio pla spi i 2 c1 i 2 c0 uart dac adc band gap reference power supply monitor pll and oscillator control watchdog timer wake up timer general purpose timer timer 0 remap and system control interrupt controller 0xffffffff 0xfffffc3c 0xfffffc00 0xfffff820 0xfffff800 0xfffff46c 0xfffff400 0xffff0b54 0xffff0b00 0xffff0a14 0xffff0a00 0xffff0948 0xffff0900 0xffff0848 0xffff0800 0xffff0730 0xffff0700 0xffff0620 0xffff0600 0xffff0538 0xffff0500 0xffff0490 0xffff048c 0xffff0448 0xffff0440 0xffff0420 0xffff0404 0xffff0370 0xffff0360 0xffff0350 0xffff0340 0xffff0334 0xffff0320 0xffff0310 0xffff0300 0xffff0238 0xffff0220 0xffff0110 0xffff0000 04955-010 figure 35. memory mapped registers table 13. complete mmr list address name byte access type default value page irq address base = 0xffff0000 0x0000 irqsta 4 r 0x00000000 74 0x0004 irqsig 1 4 r 0x00xxx000 74 0x0008 irqen 4 r/w 0x00000000 74 0x000c irqclr 4 w 0x00000000 74 0x0010 swicfg 4 w 0x00000000 75 0x0100 fiqsta 4 r 0x00000000 74 0x0104 fiqsig 1 4 r 0x00xxx000 75 0x0108 fiqen 4 r/w 0x00000000 75 0x010c fiqclr 4 w 0x00000000 75 1 depends on the level on the external interrupt pins (p0.4, p0.5, p1.4, and p1.5). system control address base = 0xffff0200 0x0220 remap 1 1 r/w 0x00 47 0x0230 rststa 1 r/w 0x01 47 0x0234 rstclr 1 w 0x00 47 1 depends on model. timer address base = 0xffff0300 0x0300 t0ld 2 r/w 0x0000 76 0x0304 t0val 2 r 0xffff 76 0x0308 t0con 2 r/w 0x0000 76 0x030c t0clri 1 w 0xff 76 0x0320 t1ld 4 r/w 0x00000000 76 0x0324 t1val 4 r 0xffffffff 76 0x0328 t1con 2 r/w 0x0000 76 0x032c t1clri 1 w 0xff 77 0x0330 t1cap 4 r/w 0x00000000 77 0x0340 t2ld 4 r/w 0x00000000 77 0x0344 t2val 4 r 0xffffffff 77 0x0348 t2con 2 r/w 0x0000 78 0x034c t2clri 1 w 0xff 78 0x0360 t3ld 2 r/w 0x0000 78 0x0364 t3val 2 r 0xffff 78 0x0368 t3con 2 r/w 0x0000 78 0x036c t3clri 1 w 0x00 79 pll base address = 0xffff0400 0x0404 powkey1 2 w 0x0000 52 0x0408 powcon 2 r/w 0x0003 52 0x040c powkey2 2 w 0x0000 52 0x0410 pllkey1 2 w 0x0000 52 0x0414 pllcon 1 r/w 0x21 52 0x0418 pllkey2 2 w 0x0000 52 psm address base = 0xffff0440 0x0440 psmcon 2 r/w 0x0008 49 0x0444 cmpcon 2 r/w 0x0000 50 reference address base = 0xffff0480 0x048c refcon 1 r/w 0x00 42
aduc7019/20/21/22/24/25/26/27 rev. a | page 35 of 92 address name byte access type default value page adc address base = 0xffff0500 0x0500 adccon 2 r/w 0x0600 39 0x0504 adccp 1 r/w 0x00 39 0x0508 adccn 1 r/w 0x01 40 0x050c adcsta 1 r 0x00 40 0x0510 adcdat 4 r 0x00000000 40 0x0514 adcrst 1 r/w 0x00 40 0x0530 adcgn 2 r/w 0x0200 40 0x0534 adcof 2 r/w 0x0200 40 dac address base = 0xffff0600 0x0600 dac0con 1 r/w 0x00 48 0x0604 dac0dat 4 r/w 0x00000000 48 0x0608 dac1con 1 r/w 0x00 48 0x060c dac1dat 4 r/w 0x00000000 48 0x0610 dac2con 1 r/w 0x00 48 0x0614 dac2dat 4 r/w 0x00000000 48 0x0618 dac3con 1 r/w 0x00 48 0x061c dac3dat 4 r/w 0x00000000 48 uart base address = 0xffff0700 0x0700 comtx 1 r/w 0x00 63 comrx 1 r 0x00 63 comdiv0 1 r/w 0x00 63 0x0704 comien0 1 r/w 0x00 63 comdiv1 1 r/w 0x00 63 0x0708 comiid0 1 r 0x01 63 0x070c comcon0 1 r/w 0x00 63 0x0710 comcon1 1 r/w 0x00 64 0x0714 comsta0 1 r 0x60 64 0x0718 comsta1 1 r 0x00 64 0x071c comscr 1 r/w 0x00 64 0x0720 comien1 1 r/w 0x04 65 0x0724 comiid1 1 r 0x01 65 0x0728 comadr 1 r/w 0xaa 65 0x072c comdiv2 2 r/w 0x0000 64 address name byte access type default value page i2c0 base address = 0xffff0800 0x0800 i2c0msta 1 r 0x00 68 0x0804 i2c0ssta 1 r 0x01 68 0x0808 i2c0srx 1 r 0x00 69 0x080c i2c0stx 1 w 0x00 69 0x0810 i2c0mrx 1 r 0x00 69 0x0814 i2c0mtx 1 w 0x00 69 0x0818 i2c0cnt 1 r/w 0x00 69 0x081c i2c0adr 1 r/w 0x00 69 0x0824 i2c0byte 1 r/w 0x00 69 0x0828 i2c0alt 1 r/w 0x00 69 0x082c i2c0cfg 1 r/w 0x00 70 0x0830 i2c0div 2 r/w 0x1f1f 70 0x0838 i2c0id0 1 r/w 0x00 70 0x083c i2c0id1 1 r/w 0x00 70 0x0840 i2c0id2 1 r/w 0x00 70 0x0844 i2c0id3 1 r/w 0x00 70 0x0848 i2c0ccnt 1 r/w 0x01 70 0x084c i2c0fsta 2 r 0x0000 71 i2c1 base address = 0xffff0900 0x0900 i2c1msta 1 r 0x00 68 0x0904 i2c1ssta 1 r 0x01 68 0x0908 i2c1srx 1 r 0x00 69 0x090c i2c1stx 1 w 0x00 69 0x0910 i2c1mrx 1 r 0x00 69 0x0914 i2c1mtx 1 w 0x00 69 0x0918 i2c1cnt 1 r/w 0x00 69 0x091c i2c1adr 1 r/w 0x00 69 0x0924 i2c1byte 1 r/w 0x00 69 0x0928 i2c1alt 1 r/w 0x00 69 0x092c i2c1cfg 1 r/w 0x00 69 0x0930 i2c1div 2 r/w 0x1f1f 70 0x0938 i2c1id0 1 r/w 0x00 70 0x093c i2c1id1 1 r/w 0x00 70 0x0940 i2c1id2 1 r/w 0x00 70 0x0944 i2c1id3 1 r/w 0x00 70 0x0948 i2c1ccnt 1 r/w 0x01 70 0x094c i2c1fsta 2 r 0x0000 70 spi base address = 0xffff0a00 0x0a00 spista 1 r 0x00 66 0x0a04 spirx 1 r 0x00 66 0x0a08 spitx 1 w 0x00 66 0x0a0c spidiv 1 r/w 0x1b 66 0x0a10 spicon 2 r/w 0x0000 66
aduc7019/20/21/22/24/25/26/27 rev. a | page 36 of 92 address name byte access type default value page pla base address = 0xffff0b00 0x0b00 plaelm0 2 r/w 0x0000 71 0x0b04 plaelm1 2 r/w 0x0000 71 0x0b08 plaelm2 2 r/w 0x0000 71 0x0b0c plaelm3 2 r/w 0x0000 71 0x0b10 plaelm4 2 r/w 0x0000 71 0x0b14 plaelm5 2 r/w 0x0000 71 0x0b18 plaelm6 2 r/w 0x0000 71 0x0b1c plaelm7 2 r/w 0x0000 71 0x0b20 plaelm8 2 r/w 0x0000 71 0x0b24 plaelm9 2 r/w 0x0000 71 0x0b28 plaelm10 2 r/w 0x0000 71 0x0b2c plaelm11 2 r/w 0x0000 71 0x0b30 plaelm12 2 r/w 0x0000 71 0x0b34 plaelm13 2 r/w 0x0000 71 0x0b38 plaelm14 2 r/w 0x0000 71 0x0b3c plaelm15 2 r/w 0x0000 71 0x0b40 placlk 1 r/w 0x00 72 0x0b44 plairq 4 r/w 0x00000000 73 0x0b48 plaadc 4 r/w 0x00000000 73 0x0b4c pladin 4 r/w 0x00000000 73 0x0b50 pladout 4 r 0x00000000 73 0x0b54 plalck 1 w 0x00 73 external memory base address = 0xfffff000 0xf000 xmcfg 1 r/w 0x00 80 0xf010 xm0con 1 r/w 0x00 80 0xf014 xm1con 1 r/w 0x00 80 0xf018 xm2con 1 r/w 0x00 80 0xf01c xm3con 1 r/w 0x00 80 0xf020 xm0par 2 r/w 0x70ff 80 0xf024 xm1par 2 r/w 0x70ff 80 0xf028 xm2par 2 r/w 0x70ff 80 0xf02c xm3par 2 r/w 0x70ff 80 address name byte access type default value page gpio base address = 0xfffff400 0xf400 gp0con 4 r/w 0x00000000 60 0xf404 gp1con 4 r/w 0x00000000 60 0xf408 gp2con 4 r/w 0x00000000 60 0xf40c gp3con 4 r/w 0x00000000 60 0xf410 gp4con 4 r/w 0x00000000 60 0xf420 gp0dat 4 r/w 0x000000xx 61 0xf424 gp0set 4 w 0x000000xx 61 0xf428 gp0clr 4 w 0x000000xx 61 0xf42c gp0par 4 w 0x20000000 61 0xf430 gp1dat 4 r/w 0x000000xx 61 0xf434 gp1set 4 w 0x000000xx 61 0xf438 gp1clr 4 w 0x000000xx 61 0xf43c gp1par 4 w 0x00000000 61 0xf440 gp2dat 4 r/w 0x000000xx 61 0xf444 gp2set 4 w 0x000000xx 61 0xf448 gp2clr 4 w 0x000000xx 61 0xf450 gp3dat 4 r/w 0x000000xx 61 0xf454 gp3set 4 w 0x000000xx 61 0xf458 gp3clr 4 w 0x000000xx 61 0xf45c gp3par 4 w 0x00222222 61 0xf460 gp4dat 4 r/w 0x000000xx 61 0xf464 gp4set 4 w 0x000000xx 61 0xf468 gp4clr 4 w 0x000000xx 61 flash/ee base address = 0xfffff800 0xf800 feesta 1 r 0x20 45 0xf804 feemod 2 r/w 0x0000 45 0xf808 feecon 1 r/w 0x07 45 0xf80c feedat 2 r/w 0xxxxx 45 0xf810 feeadr 2 r/w 0x0000 45 0xf818 feesign 3 r 0xffffff 45 0xf81c feepro 4 r/w 0x00000000 45 0xf820 feehide 4 r/w 0xffffffff 45 pwm base address = 0xfffffc00 0xfc00 pwmcon 2 r/w 0x0000 59 0xfc04 pwmsta 2 r/w 0x0000 59 0xfc08 pwmdat0 2 r/w 0x0000 60 0xfc0c pwmdat1 2 r/w 0x0000 60 0xfc10 pwmcfg 2 r/w 0x0000 59 0xfc14 pwmch0 2 r/w 0x0000 60 0xfc18 pwmch1 2 r/w 0x0000 60 0xfc1c pwmch2 2 r/w 0x0000 60 0xfc20 pwmen 2 r/w 0x0000 59 0xfc24 pwmdat2 2 r/w 0x0000 60
aduc7019/20/21/22/24/25/26/27 rev. a | page 37 of 92 adc circuit overview the analog-to-digital converter (adc) incorporates a fast, multichannel, 12-bit adc. it can operate from 2.7 v to 3.6 v supplies and is capable of providing a throughput of up to 1 msps when the clock source is 41.78 mhz. this block provides the user with a multichannel multiplexer, differential track-and-hold, on- chip reference, and adc. the adc consists of a 12-bit successive approximation converter based around two capacitor dacs. depending on the input signal configuration, the adc can operate in one of three different modes: ? fully differential mode, for small and balanced signals ? single-ended mode, for any single-ended signals ? pseudo differential mode, for any single-ended signals, taking advantage of the common-mode rejection offered by the pseudo differential input the converter accepts an analog input range of 0 to v ref when operating in single-ended mode or pseudo differential mode. in fully differential mode, the input signal must be balanced around a common-mode voltage v cm , in the range 0 v to av dd , and with a maximum amplitude of 2 v ref (see figure 36). 04955-011 av dd v cm v cm v cm 0 2v ref 2v ref 2v ref figure 36. examples of balanced signals in fully differential mode a high precision, low drift, and factory calibrated 2.5 v reference is provided on-chip. an external reference can also be connected as described later in the band g ap reference section. single or continuous conversion modes can be initiated in the software. an external conv start pin, an output generated from the on-chip pla, or a timer0 or timer1 overflow can also be used to generate a repetitive trigger for adc conversions. a voltage output from an on-chip band gap reference proportional to absolute temperature can also be routed through the front-end adc multiplexer, effectively an additional adc channel input. this facilitates an internal temperature sensor channel, which measures die temperature to an accuracy of 3 c. transfer function pseudo differential and single-ended modes in pseudo differential or single-ended modes, the input range is 0 v to v ref . the output coding is straight binary in pseudo differential and single-ended modes with 1 lsb = fs/4096, or 2.5 v/4096 = 0.61 mv, or 610 v when v ref = 2.5 v the ideal code transitions occur midway between successive integer lsb values (that is, 1/2 lsb, 3/2 lsb, 5/2 lsb, , fs ? 3/2 lsb). the ideal input/output transfer characteristic is shown in figure 37. 04955-012 output code voltage input 1111 1111 1111 1111 1111 1110 1111 1111 1101 1111 1111 1100 0000 0000 0011 1lsb 0v +fs ? 1lsb 0000 0000 0010 0000 0000 0001 0000 0000 0000 1lsb = fs 4096 figure 37. adc transfer function in pseudo differential mode or single-ended mode fully differential mode the amplitude of the differential signal is the difference between the signals applied to the v in+ and v inC pins (that is, v in+ C v inC ). the maximum amplitude of the differential signal is therefore Cv ref to +v ref p-p (that is, 2 v ref ). this is regardless of the common mode (cm). the common mode is the average of the two signals, for example, (v in+ + v inC )/2, and is therefore the voltage that the two inputs are centered on. this results in the span of each input being cm v ref /2. this voltage has to be set up externally and its range varies with v ref (see the driving the analog inputs section). the output coding is twos complement in fully differential mode with 1 lsb = 2 v ref /4096 or 2 2.5 v/4096 = 1.22 mv when v ref = 2.5 v. the designed code transitions occur midway between successive integer lsb values (that is, 1/2 lsb, 3/2 lsb, 5/2 lsb, , fs C 3/2 lsb). the ideal input/output transfer characteristic is shown in figure 38.
aduc7019/20/21/22/24/25/26/27 rev. a | page 38 of 92 04955-013 output code voltage input (v in + ? v in ?) 0 1111 1111 1110 0 1111 1111 1100 0 1111 1111 1010 0 0000 0000 0010 0 0000 0000 0000 1 1111 1111 1110 1 0000 0000 0100 1 0000 0000 0010 1 0000 0000 0000 ?v ref + 1lsb +v ref ? 1lsb 0lsb 1lsb = 2 v ref 4096 sign bit figure 38. adc transfer function in differential mode typical operation once configured via the adc control and channel selection registers, the adc converts the analog input and provides a 12-bit result in the adc data register. the top 4 bits are the sign bits. the 12-bit result is placed from bit 16 to bit 27 as shown in figure 39. again, it should be noted that in fully differential mode, the result is represented in twos complement format, and in pseudo differential and single- ended modes, the result is represented in straight binary format. 04955-014 sign bits 12-bit adc result 31 27 16 15 0 figure 39. adc result format the same format is used in dacdat, simplifying the software. current consumption the adc in standby mode, that is, powered up but not converting, typically consumes 640 a. the internal reference adds 140 a. during conversion, the extra current is 0.3 a multiplied by the sampling frequency (in khz). figure 31 shows the current consumption versus the sampling frequency of the adc. timing figure 40 gives details of the adc timing. users have control on the adc clock speed and on the number of acquisition clocks in the adccon mmr. by default, the acquisition time is eight clocks and the clock divider is two. the number of extra clocks (such as bit trial or write) is set to 19, which gives a sampling rate of 774 ksps. for conversion on temperature sensor, the adc acquisition time is automatically set to 16 clocks and the adc clock divider is set to 32. 0 4955-015 adc clock a cq bit trial data adcsta = 0 adcsta = 1 adc interrupt write conv start adc busy adcdat figure 40. adc timing aduc7019 the aduc7019 is identical to the aduc7020 except for one buffered adc channel, adc3, and it has only three dacs. the output buffer of the fourth dac is internally connected to the adc3 channel as shown in figure 41. 04955-016 1msps 12-bit adc 12-bit dac mux a dc3 adc15 dac3 aduc7019 figure 41. adc3 buffered input note that the dac3 output pin must be connected to a 10 nf capacitor to agnd. this channel should be used to measure dc voltages only. adc calibration might be necessary on this channel. mmrs interface the adc is controlled and configured via the eight mmrs described in this section. adccon register name address default value access adccon 0xffff0500 0x0600 r/w adccon is an adc control register that allows the programmer to enable the adc peripheral, select the mode of operation of the adc (either in single-ended mode, pseudo differential mode, or fully differential mode), and select the conversion type. this mmr is described in table 14.
aduc7019/20/21/22/24/25/26/27 rev. a | page 39 of 92 table 14. adccon mmr bit designations bit value description 15:13 reserved. 12:10 adc clock speed. 000 fadc/1. this divider is provided to obtain 1 msps adc with an external clock <41.78 mhz. 001 fadc/2 (default value). 010 fadc/4. 011 fadc/8. 100 fadc/16. 101 fadc/32. 9:8 adc acquisition time. 00 2 clocks. 01 4 clocks. 10 8 clocks (default value). 11 16 clocks. 7 enable start conversion. set by the user to start any type of conversion command. cleared by the user to disable a start conversion (clear ing this bit does not stop the adc when continuously converting). 6 enable adc busy . set by the user to enable the adc busy pin. cleared by the user to disable the adc busy pin. 5 adc power control. set by the user to place the adc in normal mode (the adc must be powered up for at least 5 s before it converts correctly). cleared by the user to place the adc in power-down mode. 4:3 conversion mode. 00 single-ended mode. 01 differential mode. 10 pseudo differential mode. 11 reserved. 2:0 conversion type. 000 enable conv start pin as a conversion input. 001 enable timer1 as a conversion input. 010 enable timer0 as a conversion input. 011 single software conversion; sets to 000 after conversion (bit 7 of adccon mmr should be cleared after starting a single software conversion to avoid further conversions triggered by the conv start pin). 100 continuous software conversion. 101 pla conversion. other reserved. adccp register name address default value access adccp 0xffff0504 0x00 r/w adccp is an adc positive channel selection register. this mmr is described in table 15. table 15. adccp 1 mmr bit designation bit value description 7:5 reserved 4:0 positive channel selection bits 00000 adc0 00001 adc1 00010 adc2 00011 adc3 00100 adc4 00101 adc5 00110 adc6 00111 adc7 01000 adc8 01001 adc9 01010 adc10 01011 adc11 01100 dac0/adc12 01101 dac1/adc13 01110 dac2/adc14 01111 dac3/adc15 10000 temperature sensor 10001 agnd (self-diagnostic feature) 10010 internal reference (self-diagnostic feature) 10011 av dd /2 others reserved 1 adc and dac channel availability depends on part model. see the ordering guide for details.
aduc7019/20/21/22/24/25/26/27 rev. a | page 40 of 92 adccn register name address default value access adccn 0xffff0508 0x01 r/w adccn is an adc negative channel selection register. this mmr is described in table 16. table 16. adccn mmr bit designation bit value description 7:5 reserved 4:0 negative channel selection bits 00000 adc0 00001 adc1 00010 adc2 00011 adc3 00100 adc4 00101 adc5 00110 adc6 00111 adc7 01000 adc8 01001 adc9 01010 adc10 01011 adc11 01100 dac0/adc12 01101 dac1/adc13 01110 dac2/adc14 01111 dac3/adc15 10000 internal reference (self-diagnostic feature) others reserved adcsta register name address default value access adcsta 0xffff050c 0x00 r adcsta is an adc status register that indicates when an adc conversion result is ready. the adcsta register contains only one bit, adcready (bit 0), representing the status of the adc. this bit is set at the end of an adc conversion, generating an adc interrupt. it is cleared automatically by reading the adcdat mmr. when the adc is performing a conversion, the status of the adc can be read externally via the adc busy pin. this pin is high during a conversion. when the conversion is finished, adc busy goes back low. this information can be available on p0.5 (see the general-purpose input/output section) if enabled in the adccon register. adcdat register name address default value access adcdat 0xffff0510 0x00000000 r adcdat is an adc data result register. hold the 12-bit adc result as shown in figure 39. adcrst register name address default value access adcrst 0xffff0514 0x00 r/w adcrst resets the digital interface of the adc. writing any value to this register resets all the adc registers to their default value. adcgn register name address default value access adcgn 0xffff0530 0x0200 r/w adcgn is a 10-bit gain calibration register. adcof register name address default value access adcof 0xffff0534 0x0200 r/w adcof is a 10-bit offset calibration register. converter operation the adc incorporates a successive approximation (sar) architecture involving a charge-sampled input stage. this architecture can operate in three different modes: differential, pseudo differential, and single-ended. differential mode the aduc7019/7020/7021/702 2/7024/7025/7026/7027 each contain a successive approximation adc based on two capacitive dacs. figure 42 and figure 43 show simplified schematics of the adc in acquisition and conversion phase, respectively. the adc is comprised of control logic, a sar, and two capacitive dacs. in figure 42 (the acquisition phase), sw3 is closed and sw1 and sw2 are in position a. the comparator is held in a balanced condition, and the sampling capacitor arrays acquire the differential signal on the input. 04955-017 capacitive dac capacitive dac control logic comparator sw3 sw1 a a b b sw2 c s c s v ref ain0 ain11 mux channel+ channel? figure 42. adc acquisition phase when the adc starts a conversion, as shown in figure 43, sw3 opens, and then sw1 and sw2 move to position b. this causes the comparator to become unbalanced. both inputs are discon- nected once the conversion begins. the control logic and the charge redistribution dacs are used to add and subtract fixed amounts of charge from the sampling capacitor arrays to bring the comparator back into a balanced condition. when the comparator is rebalanced, the conversion is complete. the control logic generates the adcs output code. the output impedances of the sources driving the v in+ and v inC pins must be matched; otherwise, the two inputs have different settling times, resulting in errors.
aduc7019/20/21/22/24/25/26/27 rev. a | page 41 of 92 04955-018 capacitive dac capacitive dac control logic comparator sw3 sw1 a a b b sw2 c s c s v ref ain0 ain11 mux channel+ channel? figure 43. adc conversion phase pseudo differential mode in pseudo differential mode, channel? is linked to the v in? pin of the aduc7019/7020/7021/7022/7024/7025/7026/7027. sw2 switches between a (channel?) and b (v ref ). v in? pin must be connected to ground or a low voltage. the input signal on v in+ can then vary from v in? to v ref + v in? . note that v in? must be chosen so that v ref + v in? do not exceed av dd . 04955-019 capacitive dac capacitive dac control logic comparator sw3 sw1 a a b b sw2 c s c s v ref ain0 ain11 vin? mux channel+ channel? figure 44. adc in pseudo differential mode single-ended mode in single-ended mode, sw2 is always connected internally to ground. the v in? pin can be floating. the input signal range on v in+ is 0 v to v ref . 04955-020 capacitive dac capacitive dac control logic comparator sw3 sw1 a b c s c s ain0 ain11 mux channel+ channel? figure 45. adc in single-ended mode analog input structure figure 46 shows the equivalent circ uit of the analog input structure of the adc. the four diodes provide esd protection for the analog inputs. care must be taken to ensure that the analog input signals never exceed the supply ra ils by more than 300 mv; this would cause these diodes to become forward biased and start conducting into the substrate. th ese diodes can conduct up to 10 ma without causing irrevers ible damage to the part. the capacitors, c1, in figure 46 are typically 4 pf and can be primarily attributed to pin ca pacitance. the resistors are lumped components made up of the on resistance of the switches. the value of these resistors is typically about 100 . the capacitors, c2, are the ad cs sampling capacitors and typically have a capacitance of 16 pf. a v dd c1 d d r1 c2 av dd c1 d d r1 c2 04955-021 figure 46. equivalent analog input circuit conversion phase: switches open; track ph ase: switches closed for ac applications, removing high frequency components from the analog input signal is recommended by using an rc low-pass filter on the relevant an alog input pins. in applications where harmonic distortion and si gnal-to-noise ratio are critical, the analog input should be driven from a low impedance source. large source impedances significantly affect the ac performance of the adc. this can necessitate the use of an input buffer amplifier. the choice of the op amp is a function of the particular application. figure 47 and figure 48 give an example of adc front end. 04955-061 aduc702x adc0 10 0.01 f figure 47. buffering single-e nded/pseudo differential input 04955-062 aduc702x adc0 v ref adc1 figure 48. buffering differential inputs when no amplifier is used to drive the analog input, the source impedance should be limited to values lower than 1 k. the maximum source impedance depends on the amount of total harmonic distortion (thd) that can be tolerated. the thd increases as the source im pedance increases and the performance degrades.
aduc7019/20/21/22/24/25/26/27 rev. a | page 42 of 92 driving the analog inputs internal or external reference can be used for the adc. in differential mode of operation, there are restrictions on common-mode input signal (v cm ), which is dependent on the reference value and supply voltage used to ensure that the signal remains within the supply rails. table 17 gives some calculated v cm min and v cm max for some conditions. table 17. v cm ranges av dd v ref v cm min v cm max signal peak-to-peak 2.5 v 1.25 v 2.05 v 2.5 v 2.048 v 1.024 v 2.276 v 2.048 v 3.3 v 1.25 v 0.75 v 2.55 v 1.25 v 2.5 v 1.25 v 1.75 v 2.5 v 2.048 v 1.024 v 1.976 v 2.048 v 3.0 v 1.25 v 0.75 v 2.25 v 1.25 v calibration by default, the factory set values written to the adc offset (adcof) and gain coefficient registers (adcgn) yield optimum performance in terms of end-point errors and linearity for standalone operation of the part. (see the specifications section.) if system calibration is required, it is possible to modify the default offset and gain coefficients to improve end-point errors, but note that any modification to the factory set adcof and adcgn values can degrade adc linearity performance. for system offset error correction, the adc channel input stage must be tied to agnd. a continuous software adc conversion loop must be implemented by modifying the value in adcof until the adc result (adcdat) reads code 0 to 1. offset error correction is done digitally and has a resolution of 0.25 lsb and a range of 3.125% of v ref . for system gain error correction, the adc channel input stage must be tied to v ref . a continuous software adc conversion loop must be implemented to modify the value in adcof until the adc result (adcdat) reads code 4094 to 4095. similar to the offset calibration, the gain calibration resolution is 0.25 lsb with a range of 3% of v ref . temperature sensor the aduc7019/7020/7021/7022/7024/7025/7026/7027 provide voltage output from on-chip band gap references proportional to absolute temperature. this voltage output can also be routed through the front-end adc multiplexer (effectively an additional adc channel input) facilitating an internal temperature sensor channel, measuring die temperature to an accuracy of 3 c. band gap reference each aduc7019/7020/7021/7022/7024/7025/7026/7027 provides an on-chip band gap reference of 2.5 v, which can be used for the adc and dac. this internal reference also appears on the v ref pin. when using the internal reference, a 0.47 f capacitor must be connected from the external v ref pin to agnd to ensure stability and fast response during adc conversions. this reference can also be connected to an external pin (v ref ) and used as a reference for other circuits in the system. an external buffer is required because of the low drive capability of the v ref output. a programmable option also allows an external reference input on the v ref pin. refcon register name address default value access refcon 0xffff048c 0x00 r/w the band gap reference interface consists of an 8-bit mmr refcon described in table 18. table 18. refcon mmr bit designations bit description 7:2 reserved. 1 internal reference power-down enable. set by user to place the internal reference in power-down mode and use as an external reference. cleared by user to place the internal reference in normal mode and use it for adc conversions. 0 internal reference output enable. set by user to connect the internal 2.5 v reference to the v ref pin. the reference can be used for external component but needs to be buffered. cleared by user to disconnect the reference from the v ref pin.
aduc7019/20/21/22/24/25/26/27 rev. a | page 43 of 92 nonvolatile flash/ee memory the aduc7019/7020/7021/7022/7024/7025/7026/7027 incorporate flash/ee memory technology on-chip to provide the user with nonvolatile, in-c ircuit reprogrammable memory space. like eeprom, flash memory can be programmed in-system at a byte level, although it must first be erased. the erase is performed in page blocks. as a result, flash memory is often and more correctly referre d to as flash/ee memory. overall, flash/ee memory represents a step closer to the ideal memory device that includes nonvolatility, in-circuit programmability, high density, and low cost. incorporated in the aduc7019/7020/7021/ 7022/7024/7025/7026/7027, flash/ee memory technology al lows the user to update program code space in-circuit, without the need to replace one time programmable (otp) devices at remote operating nodes. each aduc7019/7020/7021/7022/7024/7025/7026/7027 contains a 64 kb array of flash/ee memory. the lower 62 kb is available to the user and the upper 2 kb contain permanently embedded firmware, allowing in-circuit serial download. these 2 kb of embedded firmware also contain a power-on configuration routine that downloads factory calibrated coefficients to the various calibrated peripherals (such as adc, temperature sensor, and band gap references). this 2 kb embedded firmware is hidden from user code. flash/ee memory reliability the flash/ee memory arrays on th e parts is fully qualified for two key flash/ee memory characteristics: flash/ee memory cycling endurance and flash/ee memory data retention. endurance quantifies the ability of the flash/ee memory to be cycled through many program, re ad, and erase cycles. a single endurance cycle is composed of four independent, sequential events, defined as: 1. initial page erase sequence. 2. read/verify sequence a single flash/ee. 3. byte program sequence memory. 4. second read/verify sequence endurance cycle. in reliability qualification, every half word (16-bit wide) location of the three pages (t op, middle, and bottom) in the flash/ee memory is cycled 10,000 times from 0x0000 to 0xffff. as indicated in table 1, the parts flash/ee memory endurance qualification is carried out in accordance with jedec retention lifetime specification a117 over the industrial temperature range of -- -40c to +25c and +25c to +125c. the results allow the specification of a minimum endurance figure over supply temperature of 10,000 cycles. retention quantifies the ability of the flash/ee memory to retain its programmed data over time. again, the parts is qualified in accordance with the formal jedec retention lifetime specification (a117) at a specific junction temperature (t j = 85c). as part of this qualification procedure, the flash/ee memory is cycled to its specified endurance limit, described previously, before data retention is characterized. this means that the flash/ee memory is guaranteed to retain its data for its fully specified retention lifetime every time the flash/ee memory is reprogrammed. also note that retention lifetime, based on an activation energy of 0.6 ev, derates with t j as shown in figure 49. 150 300 450 600 30 40 55 70 85 100 125 135 150 retention (years) 0 04955-085 junction temperature (c) figure 49. flash/ee memory data retention programming the 62 kb of flash/ee memory can be programmed in-circuit, using the serial download mode or the jtag mode provided. serial downloading (in-circuit programming) the aduc7019/7020/7021/7022/7024/7025/7026/7027 facilitate code download via the standard uart serial port or via the i 2 c port. the parts enter serial download mode after a reset or power cycle if the bm pin is pulled low through an external 1 k resistor. once in serial download mode, the user can download code to the full 62 kb of flash/ee memory while the device is in-circuit in its target application hardware. an executable pc serial download is provided as part of the development system for serial downloading via the uart. an application note is available at www.analog.com/microconverter describing the protocol for serial downloading via the uart and i 2 c. jtag access the jtag protocol uses the on-chip jtag interface to facilitate code download and debug. an application note is available at www.analog.com/microconverter describing the protocol via jtag.
aduc7019/20/21/22/24/25/26/27 rev. a | page 44 of 92 it is possible to write to a si ngle flash/ee location address twice. if a single address is writ ten to more than twice, then the data within the flash/ee memory can be corrupted. that is, it is possible to walk zeros only byte wise. security the 62 kb of flash/ee memory available to the user can be read and write protected. bit 31 of the feepro/feehide mmr (see table 22) protects the 62 kb from being read through jtag and also in parallel programming mode. the other 31 bits of this register protect writing to the flash memory. each bit protects four pages, that is, 2 kb. write protection is activated for all types of access. three levels of protection ? protection can be set and removed by writing directly into feehide mmr. this protection does not remain after reset. ? protection can be set by writing into feepro mmr. it only takes effect after a save protection command (00c) and a reset. the feepro mmr is protected by a key to avoid direct access. the key is saved once and must be entered again to modify feepro. a mass erase sets the key back to 0ffff but also erases all the user code. ? flash can be permanently protected by using the feepro mmr and a particular value of key: 0deaddead. entering the key again to modify the feepro register is not allowed. sequence to write the key 1. write the bit in feepro corresponding to the page to be protected. 2. enable key protection by setting bit 6 of feemod (bit 5 must equal 0). 3. write a 32-bit key in feeadr, feedat. 4. run the write key command 00c in feecon; wait for the read to be successful by monitoring feesta. 5. reset the part. to remove or modify the protection, the same sequence is used with a modified value of feepro. if the key chosen is the value 0dead, then the memory protection cannot be removed. only a mass erase unprotects the part, but it also erases all user code. the sequence to write the key is illustrated in the following example (this protects writing pages 4 to 7 of the flash): feepro=0xfffffffd; //protect pages 4 to 7 feemod=0x48; //write key enable feeadr=0x1234; //16 bit key value feedat=0x5678; //16 bit key value feecon= 0x0c; // write key command the same sequence should be followed to protect the part permanently with feeadr = 0dead and feedat = 0dead. flash/ee control interface serial, parallel, and jtag programming use the flash/ee control interface, which includes eight mmrs outlined in this section. feesta register name address default value access feesta 0xfffff800 0x20 r feesta is a read-only register that reflects the status of the flash control interface as described in table 19. table 19. feesta mmr bit designations bit description 15:6 reserved. 5 burst command enable. set when the command is a burst command: 0x07, 0x08, or 0x09. cleared when another command. 4 reserved. 3 flash interrupt status bit. set automatically when an interrupt occurs, that is, when a command is complete and the flash/ee interrupt enable bit in the feemod register is set. cleared when reading feesta register. 2 flash/ee controller busy. set automatically when the controller is busy. cleared automatically when the controller is not busy. 1 command fail. set automatically when a command completes unsuccessfully. cleared automatically when reading feesta register. 0 command pass. set by microconverter when a command completes successfully. cleared automatically when reading feesta register. feemod register name address default value access feemod 0xfffff804 0x0000 r/w feemod sets the operating mode of the flash control interface. table 20 shows feemod mmr bit designations. table 20. feemod mmr bit designations bit description 15:9 reserved. 8 reserved. this bit should always be set to 0. 7:5 reserved. these bits should always be set to 0 except when writing keys. see the sequence to write the key section. 4 flash/ee interrupt enable. set by user to enable the flash/ee interrupt. the interrupt occurs when a command is complete. cleared by user to disable the flash/ee interrupt. 3 erase/write command protection. set by user to enable the erase and write commands. cleared to protect the flash against erase/write command. 2:0 reserved. these bits should always be set to 0. feecon register name address default value access feecon 0xfffff808 0x07 r/w
aduc7019/20/21/22/24/25/26/27 rev. a | page 45 of 92 feecon is an 8-bit command register. the commands are described in table 21 . table 21. command codes in feecon code command description 0x00 1 null idle state. 0x01 1 single read load feedat with the 16-bit data. indexed by feeadr. 0x02 1 single write write feedat at the address pointed by feeadr. this operation takes 20 s. 0x03 1 erase/write erase the page indexed by feeadr and write feedat at the location pointed by feeadr. this operation takes 20 ms. 0x04 1 single verify compare the contents of the location pointed by feeadr to the data in feedat. the result of the comparison is returned in feesta bit 1. 0x05 1 single erase erase the page indexed by feeadr. 0x06 1 mass erase erase 62 kb of user space. the 2 kb of kernel are protected. this operation takes 2.48 seconds. to prevent accidental execution, a command sequence is required to execute this instruction. see the command sequence for executing a mass erase section. 0x07 burst read default command. no write is allowed. this operation takes two cycles. 0x08 burst read/write write can handle a maximum of 8 data of 16 bits and takes a maximum of 8 x 20 s. 0x09 erase burst read/write automatically erases the page indexed by the write; writes pages without running an erase command. this command takes 20 ms to erase the page + 20 s per data to write. 0x0a reserved reserved. 0x0b signature give a signature of the 64 kb of flash/ee in the 24-bit feesign mmr. this operation takes 32,778 clock cycles. 0x0c protect this command can run only once. the value of feepro is saved and removed only with a mass erase (0x06) or the key. 0x0d reserved reserved. 0x0e reserved reserved. 0x0f ping no operation; interrupt generated. 1 the feecon register always reads 0x 07 immediately after execution of any of these commands. feedat register name address default value access feedat 0xfffff80c 0xxxxx r/w feedat is a 16-bit data register. feeadr register name address default value access feeadr 0xfffff810 0x0000 r/w feeadr is another 16-bit address register. feesign register name address default value access feesign 0xfffff818 0xffffff r feesign is a 24-bit code signature. feepro register name address default value access feepro 0xfffff81c 0x00000000 r/w feepro mmr provides immediate protection. it does not require any software keys, see table 22. feehide register name address default value access feehide 0xfffff820 0xffffffff r/w feehide provides protection following subsequent reset of the mmr. it requires a software key. see description in table 22. table 22. feepro and feehide mmr bit designations bit description 31 read protection. cleared by user to protect all code. set by user to allow reading the code. 30:0 write protection for pages 123 to 120, pages 119 to 116, and pages 0 to 3. cleared by user to protect the pages in writing. set by user to allow writing the pages. command sequence for executing a mass erase feedat=0x3cff; feeadr = 0xffc3; feemod= feemod|0x8; //erase key enable feecon=0x06; //mass erase command
aduc7019/20/21/22/24/25/26/27 rev. a | page 46 of 92 execution time from sram and flash/ee execution from sram fetching instructions from sram takes one clock cycle as the access time of the sram is 2 ns and a clock cycle is 22 ns minimum. however, if the instruction involves reading or writing data to memory, one extra cycle must be added if the data is in sram (or three cycles if the data is in flash/ee). one cycle to execute the instruction, and two cycles to get the 32-bit data from flash/ee. a control flow instruction (a branch instruction, for example) takes one cycle to fetch but also takes two cycles to fill the pipeline with the new instructions. execution from flash/ee because the flash/ee width is 16 bits and access time for 16-bit words is 22 ns, execution from flash/ee cannot be done in one cycle (as can be done from sram when cd bit = 0). also, some dead times are needed before accessing data for any value of cd bits. in arm mode, where instructions are 32 bits, two cycles are needed to fetch any instruction when cd = 0. in thumb mode, where instructions are 16 bits, one cycle is needed to fetch any instruction. timing is identical in both modes when executing instructions that involve using the flash/ee for data memory. if the instruction to be executed is a control flow instruction, an extra cycle is needed to decode the new address of the program counter and then four cycles are needed to fill the pipeline. a data-processing instruction involving only the core register does not require any extra clock cycle. however, if it involves data in flash/ee, an extra clock cycle is needed to decode the address of the data, and two cycles are needed to get the 32-bit data from flash/ee. an extra cycle must also be added before fetching another instruction. data transfer instructions are more complex and are summarized in table 23. table 23. execution cycles in arm/thumb mode instructions fetch cycles dead time data access dead time ld 1 2/1 1 2 1 ldh 2/1 1 1 1 ldm/push 2/1 n 2 2 x n 2 n 1 str 1 2/1 1 2 x 20 s 1 strh 2/1 1 20 s 1 strm/pop 2/1 n 1 2 x n x 20 s 1 n 1 1 the swap instruction combines an ld and str instruction with only one fetch, giving a total of eight cycles plus 40 s . 2 n is the number of data to load or store in the multiple load/store instruction (1


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